6 NEWS Issue 3 2026 Power Electronics Europe Power Electronics Europe RMAN chip resistors provide power ratings up to 2.4 W in the 1206 size and 3.4 W in the 2512 size, providing substantially higher power capability than conventional alumina-based thick film designs in compact PCB footprints. The RMAN is said to be ideal for: Industrial motor drives, inverters, and power conversion IGBT, SiC, and GaN gate drive and snubber circuits Factory automation and high-power controls EV and hybrid vehicle power electronics Battery management systems, onboard chargers, and DC-DC converters For more information about the RMAN Series Thick Film High Power Aluminium Nitride Substrate Chip Resistor, visit https://www.seielect.com/Catalog/SEI-RMAN.pdf https://www.seielect.com/ Bringing Power Electronics Technology to AI Data Centres Rimac Technology, a Croatian EV technology company specialising in battery, powertrain and electronic systems, and ECOBLOX, a global innovator in AI compute infrastructure, have announced a Joint Development Agreement to deliver a state-of-the-art Modular Data Centre (MDC) solution. The joint offering integrates Rimac Technology’s battery and power electronics technology with ECOBLOX’s AI infrastructure, MDC architecture, design and hardware/software system integration. As AI and high-performance computing drive demand for significantly more computing power, the availability of energy, cooling capacity and suitable deployment space is becoming increasingly important for data centre development. The joint solution addresses these challenges in a compact, integrated architecture built for high-density workloads. A Modular Architecture for AI Infrastructure As AI compute transitions towards 400 VDC and 800 VDC architectures, Rimac Technology says it is leveraging over a decade of high-voltage engineering expertise to develop next-generation power solutions. Partnering with ECOBLOX, the two companies are engineering high-density modular solutions tailored to the demanding power requirements of AI compute. The Modular Data Centre integrates Rimac Technology UNI battery modules, streamlining serviceability, and enabling longer continuous backup power for critical computing hardware. Its Battery Management System delivers real-time monitoring and control, streaming core telemetry directly into the ECOBLOX Data Centre Infrastructure Management platform for centralised visibility, automated alarms and analytics, while power conversion, UPS, precision cooling and IT infrastructure are unified within a single, modular footprint. Proven Technologies, Combined for AI Infrastructure Developed to strict automotive standards, Rimac Technology UNI battery modules combine high-performance density, compact packaging, built-in safety and advanced thermal management in a high-volume industrialised battery solution. They are designed for use across automotive, energy storage, marine, off-highway, commercial and industrial applications, and now AI infrastructure. As an NVIDIA Preferred Partner, ECOBLOX delivers complete, endto-end AI infrastructure—from high-density factory-engineered Modular Data Centres (MDCs) to full GPU system integration, encompassing cluster design, procurement, installation, and managed service operations. By pairing advanced air- and liquidcooled pre-fab enclosures with its proprietary DCIM and HPC/GPUaaS software stacks, ECOBLOX enables cloud providers, enterprises, and sovereign entities to deploy turnkey, exascale-ready compute directly at local power sources in just 6 to 8 months. “Partnering with Rimac Technology allows us to redefine highdensity power delivery for the next generation of AI compute,” said Doug Makishima, CEO at ECOBLOX. “By integrating automotive-grade energy storage and power electronics directly into our modular data centre architecture, we are removing grid constraints and enabling cloud providers and enterprise customers to deploy scalable, powerresilient AI clusters faster and more efficiently than ever before.” “Our battery and power electronics technologies have been developed and industrialised to meet some of the most demanding requirements in the automotive industry”, said Nurdin Pitarevic, CEO of Rimac Technology. “The same capabilities are increasingly relevant to high-power AI infrastructure, where power density, thermal management, safety and reliability are critical. Together with ECOBLOX, we are applying these technologies to a new high-power application and bringing automotive-grade technology to AI data centres.” The completed modular data centre is on track for installation at Rimac Campus in November 2026, where it will serve as a live demonstration of the joint solution and a platform for customer and partner engagement. https://www.rimac-technology.com/ https://ecoblox.com/ To receive your own copy of Power Electronics Europe subscribe today at: www.power-mag.com
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