18 POWER PASSIVE COMPONENTS Issue 3 2026 Power Electronics Europe Power Electronics Europe Anglia Components, one of Europe’s longestestablished, independent, authorised distributors of electronic components, is warning of a huge surge in demand for multi-layer ceramic chip capacitors (MLCCs). The company is advising customers that they need to get order coverage in place ASAP to prevent supply issues later in the year as the Stackpole’s HCSK1216 Shunt Resistor Delivers High Power Density for Growing AI Server Market As AI servers demand more rack power in less space, designers need compact, accurate current-sensing components. Stackpole’s HCSK1216 Kelvin-termination metal alloy shunt resistor delivers up to 10 W at 70°C in a 1216 footprint, providing high power density for space-constrained server applications. The HCSK1216 uses 75% less board area than a traditional 2725-size component while supporting the high-current sensing demands of dense server power architectures. Its four-terminal Kelvin design separates the current and voltage-sense paths, reducing lead-resistance error and power loss to improve measurement accuracy. The elevated resistive element reduces thermal stress on the PCB, while the all-metal construction provides low inductance, high pulse capability, and an operating range of -55°C to 170°C. The HCSK1216 is available in 0.3, 0.5, 1, and 2 milliohm values, with tolerances as low as 1% and TCR as low as 50 ppm/°C. The resistor is AECQ200 compliant as well as RoHS compliant, REACH compliant, lead-free, and halogen-free. Pricing starts at $0.28 each for the 1% tolerance version. Samples, volume pricing, and additional technical information are available from Stackpole Electronics and its authorised distributors. For more information about the HCSK series Kelvin termination metal alloy shunt resistor, visit https://www.seielect.com/Catalog/SEI-HCSK.pdf https://www.seielect.com/ Bourns Introduces Shielded Power Inductors for Space-Constrained Portable Electronics Anglia says: ‘MLCCs? Get ‘em now!’ tantalum capacitors and small signal discretes on the shortages list.” The surge in demand is being driven primarily by the AI datacentre buildout. Although this may seem counter-intuitive since data centres tend to use higher value MLCC products, the reality is that the production capacity for the more standard products that many customers do use is being shared with, or moved, to making the higher end products. Hence the constraint in capacity. For context, one AI data centre rack can use upwards of 440K MLCCs to manage the huge power delivery requirements of the boards. Anglia says it holds a strong profile of MLCCs from leading global suppliers including Murata, Samsung, AVX and TDK. The company has innovative inventory management programmes to help users manage the inevitable shortages that will occur in the next few months, but urges customers to react quickly. “Don’t make it easy for a broker to buy his next Lamborghini”, says Rawlins. “Schedule your orders with us now, and we’ll flex with you as your demand changes.” https://www.anglia-live.com/ situation is expected to tighten severely. Anglia’s CEO, Steve Rawlins discloses: “We are now turning away demand from brokers, in order to conserve our inventories so that we can support our loyal customer base in the UK and Europe. We’ve been warning of shortages all year and now MLCCs have joined bellwether parts such as Compact 2.0 mm x 1.2 mm footprint and 1.0 mm maximum profile support high-current power designs in wearable and mobile devices Bourns has announced the SRP201210V Series Shielded Power Inductors, a new family of compact power inductors designed for applications where board space, profile height, and power capability must be carefully balanced. The series combines a metal alloy powder core with magnetically shielded construction to support high current handling while limiting magnetic field radiation in dense electronic assemblies. The lowprofile design, featuring a maximum height of 1.0 mm, helps engineers address space constraints in portable and battery-powered products. As portable electronics continue to incorporate more functionality within smaller form factors, engineers face increasing pressure to reduce component height and board area without compromising power delivery performance. Power inductors used in these systems must provide
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