MARKET NEWS 9 Power Electronics Europe Issue 3 2026 Power Electronics Europe Farnell adds Amphenol Nexus Technologies to strengthen rugged connectivity solutions globally Farnell has announced a new partnership with Amphenol NEXUS Technologies, expanding access to rugged connector and switching solutions for customers designing and maintaining critical communications and control systems. Through the partnership, Farnell will offer Amphenol NEXUS Technologies’ portfolio of: Audio connectors Waterproof breakaway connectors TAC connectors Ranger connectors M55116/MIL-SPEC-type connectors Microphone and telephone plugs and jacks Momentary push-button switches Designed for demanding environments, the products deliver reliable performance in applications where signal integrity, durability and dependable operation are essential. The portfolio supports customers across a range of industries, including: Military and defence communications Commercial aviation electronics Telecommunications Medical devices Simulation controls Motorsport Marine applications Agricultural equipment By adding Amphenol NEXUS Technologies, Farnell provides engineers, OEMs and procurement professionals with greater access to proven connectivity solutions designed for critical communications and control systems. “This partnership gives our customers access to a broader range of trusted connectivity solutions for demanding communications and control applications,” said Tony Coletto, Vice President, Supplier Management, Farnell. “Amphenol NEXUS Technologies’ expertise in rugged audio connectors, switches and interconnect technologies helps engineers and procurement teams source reliable products that perform in harsh and mission-critical environments. Founded in 1961 and part of Amphenol Corporation since 2008, Amphenol NEXUS Technologies has built a reputation for manufacturing rugged, high-quality connector and switch solutions. Its products are widely used in military and commercial communications markets and support applications requiring reliable connectivity and mechanical performance. “We are excited to work with Farnell to make our products available to a broader global customer base,” said Greg Diblasi, General Manager, Amphenol NEXUS Technologies. “Farnell’s strong engineering audience, technical expertise and global reach make them an ideal partner. Together, we look forward to helping customers access the reliable, high-performance technologies they need for critical communications and control applications.” Amphenol NEXUS Technologies products are available now from Farnell in EMEA, Newark in North America, and element14 in APAC. https://uk.farnell.com/ Navitas Closes Acquisition of Claros, Advancing AI Infrastructure with Grid-to-xPU Power Delivery Navitas Semiconductor, a leader in next-generation power semiconductors and power delivery solutions, pioneering GaN, high-voltage and ultra-high-voltage SiC, and IVR technologies, has announced the closing of its previously announced acquisition of Claros, a power management solutions company developing integrated voltage regulator (IVR) technology for next-generation AI data centres, providing the last step to powering the xPU. The completed transaction extends Navitas’ AI infrastructure portfolio from the grid to the xPU, bringing industry-leading IVR capabilities. Claros IVR integrates power transistors, digital control, inductors and capacitors into a single IVR technology stack to enable next-generation Vertical Power Delivery (VPD) and Embedded Power Delivery (EPD) architectures. Its Packaged Integrated Voltage Regulator (pIVR) and Embedded Integrated Voltage Regulator (eIVR) products, based off the same Claros IVR technology stack, move power conversion closer to the xPU and deliver higher efficiency, faster transient response and greater power density, while the modular PowerArray architecture scales power delivery to meet the rapidly increasing demands of next-generation processors at the centre of modern AI systems. Combined with Navitas’ GaN and high-voltage and ultra-high-voltage SiC technologies that enable the new 800V DC architecture, the Company is “breaking the AI infrastructure power wall” by addressing the efficiency, power density and performance bottlenecks emerging as AI data centres and xPUs demand dramatically more power. “Closing this acquisition is a defining step in the Navitas 2.0 transformation and our strategy to power AI infrastructure from grid-to-xPU,” said Chris Allexandre, President and CEO of Navitas. “With power now the bottleneck for AI, increases in power delivery and efficiency are the key enablers of more compute output. The future of AI depends on delivering thousands of amps to increasingly power-hungry processors with unprecedented speed and precision, in addition to re-redefining the racks with higher power centralised systems and higher density architectures. This ‘power wall’ has restricted nextgeneration xPUs in megawatt-scale server racks from achieving the next wave of AI performance. Navitas 2.0 brings together GaN, high-voltage and ultrahigh-voltage SiC, and now IVR technologies to break the power wall and address power conversion across the complete grid-to-xPU architecture. “Additionally, this combination doubles our serviceable addressable market (SAM), deepens our engagement with hyperscalers and AI power platform providers, and strengthens our capabilities and leadership in power delivery for AI infrastructure. As AI power demand accelerates, we are uniquely positioned to deliver greater value for our customers, while driving sustainable long-term growth.” https://navitassemi.com/home
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