16 SIC POWER ELECTRONICS INITIATIVE https://www.heraeus-electronics.com/en/ Issue 1 2026 Power Electronics Europe www.power-mag.com Scanning acoustic microscopy confirmed the reliability of these AMB 2.0 substrates after thermal shock testing (–65°C to +150°C). Their performance rivals Agcontaining AMB, surpasses DCB substrates, and meets all customer specifications. Their integration into Valeo’s lowinductance power modules is planned as the next step. This innovation also strengthens 3. Die Top System for Copper Wire Bonding The third building block addresses top-side interconnection, a critical factor for achieving high reliability in SiC modules. Heraeus has developed the Die Top System (DTS®) in collaboration with European partners. This system features a copper foil with pre-applied sinter material, enabling copper wire bonding with over 10 Scanning acoustic microscope results after thermal cycling of AMBs attached to three different baseplate types. Source: Heraeus Electronics Scanning acoustic microscope results after thermal cycling of AMB and DCB substrates. Source: Heraeus Electronics the European AMB supply chain, with all key manufacturing partners—including metal and ceramic suppliers and Heraeus Electronics’ technology and production site— located within Europe. This supports risk mitigation, improves supply chain stability, reduces CO 2 emissions, and enhances the EU’s market position. To ensure secure global delivery capability, Heraeus Electronics also maintains a dual-source strategy in Asia. Schematic drawing of die top system DTS®. Source: Heraeus Electronics
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