https://www.heraeus-electronics.com/en/ SIC POWER ELECTRONICS INITIATIVE 15 www.power-mag.com Issue 1 2026 Power Electronics Europe Materials Innovation for Scalable SiC Integration Within the FastLane consortium, materials development plays a central role in enabling the assembly and performance of advanced SiC power modules. Among the contributors, Heraeus Electronics supports the integration of six distinct SiC module designs through three specialized packaging technologies. These innovations address key challenges in thermal management, electrical performance, and reliability—critical factors for next-generation power electronics. The company’s focus lies in developing environmentally responsible materials that facilitate miniaturization, forward integration, and high-efficiency energy conversion. In response to industry-wide shifts—such as the rise of e-mobility, AI, and next-generation communication technologies—collaborative innovation across the value chain has become essential. Heraeus Electronics engages in joint research efforts with academic institutions, start-ups, equipment providers, and end users, contributing to broader ecosystem development through EU funded initiatives and industry associations . Technical Innovations: Three Packaging Building Blocks To achieve the FastLane project goal for higher efficiency of power modules SiC dies enable them to operate at >175°C, with higher switching frequencies and increased power densities. Their effective implementation requires advanced packaging materials. Heraeus contributes within FastLane with the following key innovations: 1. Ag sinter pastes enabling attachment of Active metal brazed (AMB) substrates without noble metal surfaces 2. Ag-free AMB substrates with designs reducing parasitic inductance and 3. Die-Top System (DTS©) enabling reliable Cu bonding to SiC dies. 1. Silver Sintering for AMB Substrate Attachment on Aluminum Baseplates To reduce both cost and weight in SiC power module packaging, Heraeus has developed the PE 360P silver sinter paste, enabling the attachment of Active Metal Brazed (AMB) substrates to aluminum baseplates without the need for precious metal surfaces. This innovation offers significant advantages: Up to 70% weight reduction Cost savings of up to 91% compared to copper baseplates Initial results with PE 360P show robust AMB adhesion and minimal delamination (<5%) already with Cucoated Al baseplates after 1500 temperature cycles (–55 °C/+150 °C), Material innovations in power electronic modules addressing key challenges in thermal management, electrical performance, and reliability. Source: Heraeus Electronics Schematic drawing of AMBs sintered to baseplates. Source: Heraeus Electronics comparable to similar Ag-coated baseplates. In contrast, Ni-coated Al baseplates fail to ensure sufficient adhesion. Ongoing work focuses further on optimizing Ag sintering directly on non-precious metals coated Al. This approach supports scalable, costefficient packaging for high-performance SiC modules. 2. Silver-Free, Low-Inductance AMB Substrates The second major innovation centers on the development of silver-free, lowinductance AMB substrates using Si 3 N 4 ceramics, designed to reduce parasitic inductance and improve cost efficiency. Key benefits include: Reduced cost through elimination of silver (Ag content >60wt% in conventional AMB pastes) Reduced Ag migration for enhanced reliability Superior performance compared to traditional Direct Copper Bonded (DCB) substrates
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