AS SYSTEMS TRANSITION TO 48V ARCHITECTURES The Case for 48V Centric Power Modules Has Never Been Stronger ISSUE 1 – Feb/March 2025 www.power-mag.com Also inside this issue News | Power Semiconductors | Power Modules Heat Pumps | Automated Test Systems Product Update | Web Locator
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CONTENTS www.power-mag.com Issue 1 2025 Power Electronics Europe 3 News & Features Editor Leslah Garland Tel: +44 (0)1732 370340 Email: leslah@dfamedia.co.uk Publisher Damien Oxlee Tel: +44 (0)1732 370342 Email: damien@dfamedia.co.uk www.power-mag.com Production Editor Chris Davis Tel: +44 (0)1732 370340 Email: chris@dfamedia.co.uk Financial Manager Joanne Morgan Tel: +44 (0)1732 370340 Email: accounts@dfamedia.co.uk Reader/Circulation Enquiries Perception Tel: +44 (0) 1825 701520 Email: dfamedia@dmags.co.uk INTERNATIONAL SALES OFFICES Mainland Europe: Victoria Hufmann Norbert Hufmann Tel: +49 911 9397 643 Fax: +49 911 9397 6459 Email: pee@hufmann.info Eastern US Damien Oxlee Tel: +44 (0)1732 370342 Email: damien@dfamedia.co.uk Western US and Canada Damien Oxlee Tel: +44 (0)1732 370342 Email: damien@dfamedia.co.uk Japan: Yoshinori Ikeda, Pacific Business Inc Tel: 81-(0)3-3661-6138 Fax: 81-(0)3-3661-6139 Email: pbi2010@gol.com Taiwan Prisco Ind. Service Corp. Tel: 886 2 2322 5266 Fax: 886 2 2322 2205 Circulation and subscription: Power Electronics Europe is available for the following subscription charges. Power Electronics Europe: annual charge UK/NI £95, overseas $160, EUR 150. Contact: DFA Manufacturing Media, 192 High Street, Tonbridge, Kent TN9 1BE Great Britain. Tel: +44 (0)1732 370340. Refunds on cancelled subscriptions will only be provided at the Publisher’s discretion, unless specifically guaranteed within the terms of subscription offer. Editorial information should be sent to The Editor, Power Electronics Europe, 192 High Street, Tonbridge TN9 1BE U.K. The contents of Power Electronics Europe are subject to reproduction in information storage and retrieval systems. All rights reserved. No part of this publication may be reproduced in any form or by any means, electronic or mechanical including photocopying, recording or any information storage or retrieval system without the express prior written consent of the publisher. Printed by: Warners. ISSN 1748-3530 PAGE 4 News PEE looks at the latest News and company developments PAGE 12 Power Semiconductor Industry Cambridge GaN Devices secures $32M to drive global growth in power semiconductor industry. PAGE 14 Microgate helps penetrate deep space to unlock secrets of the Universe Adaptive optics using precision power conversion technologies enable world-changing discoveries PAGE 18 5 Key Uses for Virtual and Augmented Reality in Electronics Manufacturing PAGE 21 Heat pumps call for optimised solutions Frank Malik, Radoslav Valchev, Toshiba Electronics Europe GmbH PAGE 25 Automated Test Equipment Revival Repurposing and Extending the Life of Aging ATE Systems. PAGE 28 Product Update PAGE 31 Web Locator The Case for 48V Centric Power Modules Has Never Been Stronger By Maury Wood, VP Strategic Marketing & BU Operations, Vicor More details on page 8. FEATURE STORY Subscribe for your FREE copy now To receive your own copy of Power Electronics Europe subscribe today at: www.power-mag.com
4 NEWS Issue 1 2025 Power Electronics Europe www.power-mag.com Subscribe today at: www.power-mag.com Navitas’ GaN & SiC Devices Power Dell’s Family of AI Notebooks GaNFast and GeneSiC power technologies deliver portability, efficiency, and sustainability for Dell AI notebook computer adapters from 60 W to 360 W Navitas Semiconductor (Nasdaq: NVTS), an industry leader in next-generation GaNFast gallium nitride (GaN) and GeneSiC silicon carbide (SiC) power semiconductors, has announced its adoption of both technologies into Dell’s family of notebook adapters, from 60 W to 360 W. Enabled by over 20 years of SiC technology leadership, GeneSiC leads on performance of SiC MOSFETs with patented ‘trench-assisted planar’ technology and 5th-gen GeneSiC silicon carbide (SiC) diodes to deliver highspeed, high-efficiency performance with proprietary ’low-knee’ technology for cool operation. Navitas’ GaNFast power ICs enable highfrequency, high-efficiency power conversion, achieving 3x more power and 3x faster charging in half the size and weight compared to prior designs with legacy silicon power devices. Navitas GaN & SiC technology together enables Dell to provide high-speed charging, with highest efficiency, coolest temperature, smallest size, and lowest material count. Dell’s latest line-up of AI notebooks includes Neural Processor Units (NPUs), which are dedicated AI engines, to manage sustained AI and AI offload. This builds on Dell’s portfolio as the broadest GaN adapter offering for notebooks in the industry. The new adapters will also help Dell achieve its advanced sustainability goals, with a focus on CO2 reduction and energy reduction. The adapter cases require up to 50% less plastic and are made with postrecycled materials, significantly reducing energy waste, and improving resource utilization. Navitas’ GaNFast and GeneSiC technologies increase the level of system integration and switching frequency, which reduces the number of components, as well as the size, resulting in a ‘dematerialization’ that lowers carbon footprint throughout the production, packaging, and logistics processes. Each GaNFast power IC shipped saves 4 kg CO2 and every SiC MOSFET shipped saves 25 kg CO2 vs. legacy silicon power chips. “Since Dell’s first GaN adapter was enabled by Navitas back in 2020, we’ve worked closely with Dell engineering to further improve charging speed, efficiency, size, weight, and now environmental footprint”, said Gene Sheridan, CEO and cofounder of Navitas. “Dell’s new adapters are an optimal solution for speed, portability, and sustainability. Our clients achieve a winwin for both the market and environment by deploying Navitas GaNFast power ICs and GeneSiC power devices.” For more information on our GaNFast portfolio and charging system solutions, please contact info@navitassemi.com or visit www.navitassemi.com.
NEWS 5 Power Electronics Europe Issue 1 2025 Power Electronics Europe The European Commission’s latest effort to facilitate a more circular economy - the Ecodesign for Sustainable Products Regulation (ESPR) - came into force last year and set in motion a series of eco-conscious actions for electronics manufacturers to follow who place products in the EU marketplace. Since this announcement, some have started their compliance journeys to prepare for the regulation’s Digital Product Passport (DPP) mandate but others simply don’t know where to start. To address the initial action needed by the electronics industry, the first stage will be identifying and validating data to support compliance - a step likely to be challenging. As a quick recap, DPPs act as a digital record of a physical product, securely keeping track of information across a product’s lifecycle, including event or transactional data, or even data concerning its sustainability credentials. For example, the carbon footprint of its production. While specific DPP requirements for each product group impacted - via the delegated acts - are yet to be published, the first crucial step of gathering and validating data can be actioned now. To start this data validation journey, collaborating with all stakeholders will prove pivotal in identifying existing environmental data. Such transparent discussions are likely to uncover hidden insights and highlight opportunities to improve data transparency. Similarly, conducting a data gap analysis early on will ensure missing information is pinpointed and enable businesses to consider the information likely to be required in the DPPs - i.e. data on production waste or carbon footprints. This will enable firms to develop strategies for closing Data Challenges amidst the EU’s upcoming DPP mandate gaps, adopt new tools, or partner with specialists. Additionally, considering a Life Cycle Assessment (LCA) to measure a product’s environmental impact across its lifecycle, from raw material extraction to disposal, will provide a comprehensive view to address identified gaps. Throughout these first steps, validating data sources to build an accurate, verifiable picture of each product is crucial - this includes assessing the credibility of third-party data suppliers and ensuring relevant standards are maintained. Due to the complexity, building a DPP solution won’t be possible for most businesses, so seeking out specialist partners will prove invaluable. Such partners should consider the creation and implementation of DPPs in a bespoke manner and focus on factors such as ease of use, scalability, and resource requirements for seamless adoption. By following these steps, alongside ensuring a pilot is conducted to refine processes, capture insights, and estimate the scale and timeline for full deployment, businesses can efficiently prepare for DPP integration and ensure long-term sustainability compliance. To learn more about this and get a head start on DPP integration, reach out to DPP provider Protokol here: https://www.protokol.com/services/digital -product-passport-consulting/. Infineon technologies says after announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest 200millimeter silicon carbide (SiC) power fab in Kulim, Malaysia, it has unveiled the next milestone in semiconductor manufacturing technology. The company says it has reached a breakthrough in handling and processing the thinnest silicon power wafers ever manufactured, with a thickness of only 20 micrometres and a diameter of 300 millimetres, in a high-scale semiconductor fab. The ultra-thin silicon wafers are only a quarter as thick as a human hair and half as thick as current state-of-the-art wafers of 40-60 micrometres. “The world’s thinnest silicon wafer is proof of our dedication to deliver outstanding customer value by pushing the technical boundaries of power semiconductor technology,” said Jochen Hanebeck, CEO at Infineon Technologies. “Infineon’s breakthrough in ultra-thin wafer technology marks a significant step forward in energy-efficient power solutions and helps us leverage the full potential of the global trends decarbonisation and digitalisation. With this technological masterpiece, we are solidifying our position as the industry’s innovation leader by mastering all three relevant semiconductor materials: Si, SiC and GaN.” The company says this innovation will significantly help increase energy efficiency, power density and reliability in power conversion solutions for applications in AI data centres as well as consumer, motor control and computing applications. For more information visit https://www.infineon.com/cms/en/ about-infineon/press/press-releases/2024/INFXX202410-013.html Infineon announces the next milestone in semiconductor manufacturing technology
6 NEWS Issue 1 2025 Power Electronics Europe Power Electronics Europe The upcoming 40th Annual Applied Power Electronics Conference (APEC 2025), running March 16-20 at the Georgia World Congress Center in Atlanta, is shaping up to be an exceptional celebration of its 40th anniversary. Since 1986, the APEC conference and exposition has continued the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer. This year’s APEC 2025 will offer the most extensive programme in the event’s history, including Technical Sessions (Papers), Industry Sessions and Professional Education Seminars—plus a Plenary Session, a vibrant Exposition, as well as several Special Events and Social Activities. APEC 2025 General Chair, Aung Thet Tu, noted APEC’s exponential growth since its inception: “Forty years ago, we had 250 attendees and 20 exhibitors. The 1986 conference program included seven sessions, 34 technical papers and six professional education seminars. In comparison, APEC 2025 is projected to have over 6,000 attendees and over 300 exhibitors—and a conference program of 750 technical presentations and 18 professional education seminars” Power electronics technologies are a key element in many of today’s highvisibility, high-growth global markets, which makes this year’s APEC especially relevant to industry professionals. Vehicle electrification, alternative energy sources, battery technologies, data center high-efficiency power conversion, wearable electronics, and energy harvesting are among the many topics being addressed. Accordingly, press representatives are expected to cover the event in record numbers, with over 20 technical journals registered, to date. APEC is sponsored by the IEEE Power Electronics Society (PELS), the IEEE Industry Applications Society (IAS) and the Power Sources Manufacturers Association (PSMA). PSMA is also celebrating its 40th anniversary in 2025. APEC 2025 Publicity Co-chair, Kathy Naraghi, acknowledged the many Supporting Publications for their role in the remarkable interest in the 2025 conference and exposition. “We are so appreciative of all the journals providing promotional support. Thanks to these publications and their editorial staff, our 40th anniversary APEC promises to be one of our best-attended yet.” APEC 2025 Marks the Applied Power Electronics Conference’s 40th Anniversary NECTO Studio V7.1 IDE from MIKROE now includes full programmer and debug support for Microchip tools Also adds support for Microchip’s SAM MCU and STMicroelectronics’ STM32L4 series of ultra-low-power MCUs MIKROE, an embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, has announced that the latest 7.1 release of the company’s NECTO Studio IDE (integrated development environment) is even easier for users of Microchip MCUs to work within, benefitting from the time-tomarket advantages that the NECTO ecosystem delivers. Following close collaboration between Microchip and MIKROE, NECTO 7.1 now includes full programmer and debugger support for the following tools: MPLAB ICD 5, MPLAB ICD 4, MPLAB ICE 4, Atmel-ICE, PICkit On-Board 4 (PKOB4), EDBG, Power Debugger, MPLAB PICkit 5, MPLAB PICkit 4, MPLAB Snap, JTAGICE3, PKOB nano, mEDBG and Simulator. More, the mikroSDK 2.0 software development kit which runs natively within NECTO Studio, making application code portable and reusable on many different platforms and architectures, with virtually no code changes, has been further enhanced with support for 66 new MCUs from the SAM E70/S70/V70/V71 series, a robust Arm® Cortex®-M7 lineup running at up to 300 MHz. In addition, full mikroSDK support is now available for the STM32L4x family. Comments Nebojsa Matic, CEO of MIKROE: “Getting started with NECTO and Microchip is simple: create a new NECTO setup with one of Microchip compilers XC8, XC16, or XC32; select your preferred Microchip programmer from the supported list; and apply new NECTO setup to an existing project or start a brand-new one. We remain committed to expanding our MCU offerings on a daily basis, so stay tuned for even more additions!”
Organised by 4 - 5 June 2025 | NEC Birmingham Part of What’s driving the next wave of industrial innovation? At Drives & Controls 2025, five key topics lead the way: Motion Control Robotics & Automation Power Transmission Machine Safety Energy Efficiency Explore these crucial themes across our 8 content theatres this June at the NEC. smartmanufacturingweek.com
8 48V-CENTRIC POWER MODULES www.vicorpower.com Issue 1 2025 Power Electronics Europe www.power-mag.com The Case for 48V Centric Power Modules Has Never Been Stronger Advancing semiconductor technology and global competitive forces have resulted in a stunning increase in the power density of numerous equipment types in the industrial, automotive, aerospace and high-performance computing markets over the last ten years. The vast energy required to power generative AI computing data centers is at the forefront of this megatrend. If power systems engineers do not consider new approaches to address these exponential increases, power supplies will become an ever-greater contributor to increased system size (specifically volume), weight and cost. Furthermore, all other things being equal, the rise in equipment power demands will see an equivalent rise in thermal management requirements, contributing to the expansion of power system form factors and recurring costs. Clearly, new approaches (including architectures, topologies and packaging methods) and innovative solutions are urgently needed. 48V-centric power modules with high conversion efficiency and power density have arrived to meet these intertwined and complex challenges. Evolution from 12V to 48V Power Delivery Networks The transition across numerous markets from 12V toward 48V power delivery networks (PDN’s) is accelerating. For example, the first 48V PDN electric vehicles are on the road today with many in development, and 48V distribution within data center racks among Hyperscalers is now commonplace. Power system design engineers should weigh the relative merits of 48V PDNs as a logical starting point for the power delivery architecture of their electrical power subsystem. The transition to 48V-centric power distribution is not without challenges. The 12V centric power component ecosystem offers maturity and know-how accumulated over about 75 years. There is a multiplicity of 12V optimized power component and power supply options available on the market, and power system designers are typically comfortable with this technology in all its facets. By comparison, the 48V-centric power components and subsystems are less established, with wide 48V adoption in data center server racks first appearing in 2021. Power system engineers are less familiar with power components and subsystems needed to support a 48V-centric PDN design, and have relatively less development experience with 48V distribution hub architectures. However, by sourcing 48V DC-DC converter power modules, with integrated magnetics can eliminate areas of technical and commercial risk and uncertainty, as the module manufacturer assumes all design, sourcing, testing, quality and reliability responsibilities, shielding the end system designer from this ecosystem immaturity (Figure 1). Additionally, many existing 12V subsystem loads are fully cost-optimized and are not financially or functionally sensible to replace in the short to medium term, so bridging between a 48V and 12V centric PDN can achieve the optimal system design. Importantly, both 12V and 48V are considered SELV (Safety Extra Low Voltage) levels, so moving to 48V power distribution hubs does not compromise human safety. Types of 48V-Centric Power Modules There are many types of power modules that offer a full DC-DC converter function, with high power density and some that incorporate integrated magnetics. High voltage (up to 920VDC) BCM’s (fixed-ratio DC-DC bus converter modules), are typically galvanically isolated (4,242V is typical and a conversion ratio of K = 1/8 yields 50VOUT from 400VIN for example and a K = 1/16 yields 50VOUT from 800VIN). NBM’s (low-voltage non-isolated fixedratio bus converters) are also available (K = 1/4 yields 12V from 48VIN) and enable the bridging function between the 48V and 12V centric PDN’s. Regulated DC-DC converters are also available. A good example of a regulated fixed-ratio converter is the DCM3735, a 2kW, 160A, 48V to 12V converter (Figure 2). Power system engineers can take advantage of these power modules by utilizing higher system bus distribution voltages requiring lower current to deliver Figure 1: The 12V ecosystem is well established and in many cases is fully cost-optimized. So bridging between a 48V and 12V-centric power delivery network using DC-DC converter modules is the optimal solution to ease the path to 48V power designs. By Maury Wood, VP Strategic Marketing & BU Operations, Vicor
www.vicorpower.com 48V-CENTRIC POWER MODULES 9 www.power-mag.com Issue 1 2025 Power Electronics Europe the same power. For OEMs, this consequence of Ohm’s Law can yield superior electrical, mechanical and thermal performance, higher overall system efficiency and significant economic benefits. Important Attributes to Look for in a Power Module A top-level attribute of best-in-class 48Vcentric power modules is high volumetric power density (continuous output power per cubic inch or W/in3), achieved through innovative circuit structures and topologies, as well as state-of-the-art thermal and mechanical packaging. A related distinguishing characteristic of power modules is package thickness, which can be as thin as 7mm in advanced products. Thin packages enable lower thermal resistance, and three-dimensional electroplating (i.e., bottom, top and sides) provides a coplanar thermal conduction interface perfectly suited for heat sinks and coldplates (Figure 3). Due to increasing equipment electrification across broad sectors of the global economy and the rising power demands across numerous end-market equipment types, liquid cooling solutions are increasingly more popular. This trend is synergistic with overmolded, high power density, thin power modules, which are exceptionally thermally adept (i.e., high thermal conductivity as measured in watts per meter per Kelvins). Designers should also consider overmolded 48V-centric power modules with integrated magnetics, as an easier way to present a planar thermal interface of all power dissipative components to heat sinks, heat pipes or coldplates. Power conversion efficiency is a critically important performance parameter. At high output power levels, the power loss heat load is substantial, even when continuous conversion efficiency is relatively high. For example, at 2.4kW (50AOUT at 48VOUT) at 98% efficiency is still 48W of power loss that must be continuously thermally managed. Therefore modules should offer very high DC-DC conversion efficiency across operating temperature to simplify thermal management solutions. integrated magnetics also minimize external circuitry, easing the system design process. For systems requiring industrial grade, military grade or automotive grade, modules are qualified by their manufacturer to rigorous electrical, mechanical and environmental standards, including temperature cycling, humidity exposure and shock/vibration testing, and are automatically production tested (i.e., using ATE) as a complete system to well-specified performance limits. This eliminates the need for the OEM to conduct separate qualification and performance characterization tests. From the OEM perspective, power modules are a single bill of materials (BOM) item (Figure 4). The fact that there are dozens of components within the module is opaque to the end customer. By contrast, a discretely implemented power supply has a multiplicity of components that must be purchased, kitted, assembled, tested and managed (due to potential product obsolescence) over the lifetime of the equipment that utilizes the power supply. The use of a system-level DC-DC converter power module therefore effectively eliminates numerous points of failure, increasing end-product quality. The purchasing effort and inventory management costs of power modules Figure 2: Vicor automotive grade BCM6135, DCM3735 and PRM3735 power modules have set a new standard for power density in the automotive industry. Collectively they solve complex conversion challenges with 800V, 400V, 48V and 12V systems for xEVs power systems. Figure 3: The thermal engineering of modern electronic systems has become a key design consideration. Discrete power designs are typically more complicated arrangements and are more challenging to cool compared to modular solutions that are thinner, more uniform designs. Thin packages enable lower thermal resistance, and three-dimensional electroplating (i.e., bottom, top and sides) provides a coplanar thermal conduction interface perfectly suited for heat sinks and coldplates. Robust and Simplified System Designs Overmolded power modules are also mechanically robust and more thermally adept easing the thermal management design challenge. Modules that offer full DC-DC converter solutions with are significantly lower than discrete component power systems. This allows power systems engineers to leverage their trusted supplier’s cutting-edge materials science, circuit design and conversion topological innovation with little to no learning curve overhead.
10 48V-CENTRIC POWER MODULES www.vicorpower.com Issue 1 2025 Power Electronics Europe www.power-mag.com Ease of Use and Power Scaling Considerations For power scaling needs and achieving a faster design time, power modules should be capable of operating in current-shared parallel arrays. As the power system demands increase, it is possible to double or quadruple the output power through a relatively easy subsystem redesign. An important characteristic of modern PDNs is reverse (or bidirectional) operation. The classic example is electric vehicle regenerative braking, where energy is returned to the battery pack from the traction motor inverters during braking. Bidirectional operation appears in many electrification use cases, and best-in-class power modules will offer either instantaneous reverse power conversion or reverse power conversion under digital control. Fixed-ratio BCMs and NBMs are inherently bidirectional and enable new depths of innovation. In some specific cases, modules are designed to comply with a variety of standards, including FCC/EU EMI (conducted and radiated), as well as safety and environmental standards administered by CE, ECHA RoHS, CSA, UKCA, TUV and UL/IEC. High voltage isolated power modules should have also undergone high potential (HIPOT) safety testing. This is a significant reduction in engineering operating expense (otherwise frequently outsourced) and the capital expense of related test equipment, as well as a valuable project schedule risk reduction mitigation. Additionally, module-level product safety certifications are vital for gaining power-subsystem-level regulatory approvals. A trusted supplier should provide comprehensive technical support and collateral, including complete data sheets, application notes, electrical, 3D mechanical and thermal simulation models, design guides and evaluation board systems. These are essential tools for design engineering success. Electric Vehicles Save Weight and Capitalize on Transient Response with Power Modules Automotive BEV and recreational light electric vehicle (LEV) OEMs need to show continuous performance improvement aspects beyond those of their gasolinepowered progenitors to continue to win new customers. Vehicle acceleration and battery life (i.e., vehicle range) are critical performance elements that often influence the buying decisions of EV consumers. Small size and weight, high volumetric power density and simple, inexpensive, robust passive cooling solutions are of vital consumer marketing value to OEMs. Additionally, the use of a module-level PDN solutions frees the vehicle system designers to focus on other product development tasks because modules with high power density can solve the size and weight problems of a design. Superior load transient response of topologies such as the Vicor SAC™ (Sine Amplitude Converter) enables numerous innovative applications in electric vehicles, including active suspension, drive-by-wire, steer-by-wire, 12V and 48V battery and supercapacitor elimination. Best-in-class modules offer industry-leading efficiency and power density, delivering outstanding electrical performance even when de-rated for use with passive heat sinks (or in some chassis or body mount applications). The robust mechanical construction of overmolded modules is well suited to the harsh environments of rugged electric recreational vehicles. The use of a 48V zonal architecture results in much thinner cabling throughout the vehicle, which is a substantial weight and cost savings (Figure 5). Furthermore, thinner distribution power bus wires are easier to route, giving vehicle chassis and body designers more freedom from three dimensional design constraints. The reduced cable power dissipation at 48V also yields improved vehicle range. The automotive EV designs are migrating rapidly to 48V distribution hubs with 12V zones for legacy subsystems. The global auto industry supply chain will drive rapid cost reduction of the components of this “zonal architecture” to the benefit of LEV developers. Consider choosing a 48V module supplier that can offer automotive-grade modules with APQP process and AECQ100 qualification attributes. These automotive grade modules are also available to LEV platform developers in the event they require AECQ-100 level reliability. Factory Automation Equipment Benefits from Thinner Wiring and “massimetric power density” Industrial robots are evolving to include autonomous (untethered and batterypowered) capabilities and integrated genAI inferencing processors. Importantly, 48V cabling saves robot weight and cost versus 12V cabling, and is far easier to route mechanically, which is helpful for anthropogenic (humanoid) robots designs that are relatively trim. Figure 4: Prequalified miniaturized power modules offer a number of benefits over discrete designs. Power modules are a single bill of material (BOM) item and eliminate numerous points of failure. The fact that there are dozens of components internal to the module is opaque to the end customer. By contrast, a discretely implemented power supply has many components that must be purchased, kitted, assembled, tested and managed over the lifetime of the equipment. To receive your own copy of Power Electronics Europe subscribe today at: www.power-mag.com
www.vicorpower.com 48V-CENTRIC POWER MODULES 11 www.power-mag.com Issue 1 2025 Power Electronics Europe Some industrial mobile robots are quite small, so small 48V power modules and thinner wire harnesses are clearly advantageous for these designs (Figure 6). Higher volumetric power density means lower robot weight for the same level of power delivery as alternative lower power density solutions, which extends operating time between battery recharges; this is a critical end-customer purchasing consideration. For autonomous vehicular robots, including limbed humanoid robots, an important power delivery criterion is “massimetric power density.” This is measured in continuous output watts per gram (W/g). Robot weight defines many performance aspects given the physical constraints of battery size, cost and aggregate, the multiplicity of technical, economic and performance-based advantages that 48V power delivery networks enable for next-generation equipment hardware designs are extremely compelling. Vicor power modules offer industryleading high voltage (800V/400V to 48V to 12V) zonal bridging, and low-voltage, high-current point-of-load solutions that address all modern hardware design requirements. With the world’s first ChiP™ (Converter housed in Package) high volume fabrication process, and a fully vertically integrated and automated factory, Vicor is ready and able to meet today’s advanced 48V power module demands. www.vicorpower.com Figure 5: EVs are migrating toward 48V power delivery networks with 12V zones to accommodate legacy subsystems. Vicor compact, lightweight DC-DC converters make point of load conversion easy and highly efficient. Figure 6: Humanoid robots have numerous power domains with diverse loads. Vicor’s broad family of 48-centric power modules adds flexibility to the design process and can accommodate many loads with high efficiency. chemical power density. Every opportunity to reduce weight is valuable, including the weight of the power delivery 48V DC-DC converters. 48V DC-DC converters appropriate for robot designs are capable of delivering more than 60W per gram (2kW at 29 grams) – a solid benchmark for regulated output converters. Power Modules Accelerate the Adoption of 48V These two real-world market segment examples illustrate and underscore the tremendous advantages that 48V-centric (HVDC to 48V and 48V to 12V) highpower-density modules bring to a broad spectrum of industrial, high-performance computing, aerospace and defense and automotive power system designs. In
12 POWER SEMICONDUCTORS https://camgandevices.com/ Issue 1 2025 Power Electronics Europe www.power-mag.com Power Semiconductor Industry Cambridge University spinout secures Series C funding to expand its operations in Cambridge, North America, Taiwan and Europe Cambridge GaN Devices (CGD) develops energy-efficient semiconductors using gallium nitride (GaN), reshaping the future of power electronics CGD’s technology will help electric vehicles and data centres be more energy efficient, presenting major opportunities in the global power semiconductor industry Cambridge GaN Devices (CGD), a leading innovator in gallium nitride (GaN) power devices, has successfully closed a $32 million Series C funding round. The investment was led by a strategic investor with participation from British Patient Capital and supported by existing investors Parkwalk, BGF, Cambridge Innovation Capital (CIC), Foresight Group, and IQ Capital. Transforming Power Electronics with GaN Gallium nitride-based devices represent a breakthrough in power electronics, offering faster switching speeds, lower energy consumption, and more compact designs than traditional silicon-based solutions. CGD’s proprietary monolithic ICeGaN® technology, which simplifies the implementation of GaN into existing and progressive designs, delivers efficiency levels exceeding 99%, enabling energy savings of up to 50% in a wide range of high-power applications including electric vehicles and data centre power supplies. These innovations have the potential to save millions of tons of CO2 emissions annually, accelerating the global transition to more sustainable energy systems due to the inherent ease-of-use that ICeGaN® technology provides to its customers. Dr. Giorgia Longobardi, CEO and Founder of CGD: “This funding round marks a pivotal moment for CGD. It validates our technology and vision to revolutionize the power electronics industry with our efficient GaN solutions and make sustainable power electronics possible. We’re now poised to accelerate our growth and make a significant impact in reducing energy consumption across multiple sectors. We look forward to collaborating with our strategic investor to penetrate the automotive market”. Market Opportunity and Proven Success The global GaN power device market is Cambridge GaN Devices secures $32M to drive global growth in power semiconductor industry. CGD Team
https://camgandevices.com/ POWER SEMICONDUCTORS 13 www.power-mag.com Issue 1 2025 Power Electronics Europe projected to grow at a remarkable CAGR of 41%, reaching $2 billion by 20291. At the same time, ICeGaN® is being seen as a viable alternative to existing solutions using Silicon Carbide (SiC), combining high energy-efficiency, miniaturization, and monolithically integrated smart functionalities. This will enable Cambridge GaN Devices to have access to a high power market estimated to be in excess of $10 billion by 20291. With its cutting-edge technology and market leadership position, CGD is well positioned to capitalize on this rapid market expansion. Having successfully secured industry-leading customers in their pipeline, CGD has consistently demonstrated its ability to deliver reliable and impactful solutions, enabling innovation in the sector. Henryk Dabrowski, SVP of Sales CGD:” I’m thrilled to see this funding helping to deliver on customer deals we’ve already closed for CGD’s latest-generation P2 products. This investment will significantly boost our ability to meet the growing demand for our reliable and easy-to-use GaN solutions.” Global Expansion and Vision for the Future With a global team of experts, decades of research, and a commitment to pushing the boundaries of GaN technology, CGD continues to deliver solutions that enhance everyday electronics. As the world advances toward electrification and sustainability, CGD’s leadership in GaN technology offers a pathway to reduce energy consumption, lower costs, and mitigate environmental impact. By enabling efficient, compact, and high-performance power devices, CGD is setting a new standard for sustainable power electronics. The funding will enable the company to expand its operations in Cambridge, North America, Taiwan and Europe, and deliver CGD’s unique value proposition to its growing customer base. This significant investment will fuel CGD’s growth strategy, focusing on the continued delivery of highly efficient GaN products to high-power industrial, data centre, and automotive markets. John Pearson, Chief Investment Officer Parkwalk Advisors: “CGD is at the forefront of technology that can reduce the energy demands of booming industries, like Artificial Intelligence and Electric Mobility. It has enormous global potential and widespread applications which will see CGD continue to innovate and grow. We are proud to have backed CGD since 2019 and are excited to be working with an exceptional team and cohort of other investors to accelerate its global expansion.” George Mills, Director, Deeptech - Direct & Co-Investments, British Patent Captal: “Following years of research, Cambridge GaN Devices have proven the impact of their semiconductor technology. Their GaN devices consume less energy than their silicon-based counterparts, which both reduces costs and has a positive environmental impact. It’s valuable technology that now needs long-term capital to scale.” https://camgandevices.com/ Name: Company Name: Address: Post Code: Tel: Total Number of Copies @ £ p+p Total £ Drives S & S Hyd H/B Pne H/B Ind Mot Comp H/B H/B Air QUANTITY QUANTITY Hydraulics & Pneumatics There are now 6 of these handy reference books from the publishers of the Drives & Controls and Hydraulics & Pneumatics magazines. Published in an easily readable style and designed to help answer basic questions and everyday problems without the need to refer to weighty textbooks. We believe you’ll find them invaluable items to have within arms reach. From the publishers of QUANTITY QUANTITY QUANTITY 2-5 copies £4.30, 6-20 copies £4.10, 20+ copies £3.75. QUANTITY PRACTICAL ENGINEER’S HANDBOOKS HYDRAULICS INDUSTRIAL MOTORS SERVOS AND STEPPERS PNEUMATICS COMPRESSED AIR INDUSTRIAL ELECTRIC DRIVES PLEASE ALLOW UPTO 28 DAYS FOR DELIVERY $&! -!.5&!#452).' -%$)! ,4$ 4HE (IGH 3TREET 4ONBRIDGE +ENT 4. "% Postage and Packaging: 1-3 copies: £2.99 4-6 copies: £4.99 7 or more copies: £6.99 If you would like to obtain additional copies of the handbooks, please email info@dfamedia.co.uk or call us on 01732 370340. Alternatively you can return the completed form below to: Engineers Handbook, DFA MANUFACTURING MEDIA LTD, 192 The High Street, Tonbridge, Kent TN9 1BE #HEQUES SHOULD BE MADE PAYABLE TO $&! -ANUFACTURING -EDIA ,TD AND CROSSED ! # 0AYEE #OPIES OF THE HANDBOOKS ARE AVAILABLE AT a PER COPY $ISCOUNTS ARE AVAILABLE FOR MULTIPLE COPIES To receive your own copy of Power Electronics Europe subscribe today at: www.power-mag.com
14 POWER MODULES www.vicorpower.com Issue 1 2025 Power Electronics Europe www.power-mag.com Microgate helps penetrate deep space to unlock secrets of the Universe Adaptive optics using precision power conversion technologies enable world-changing discoveries Established in 1989 by brothers Vinicio and Roberto Biasi, Microgate built its early reputation providing highly accurate timing devices for professional sports and racing events. Driven by a focus on extreme precision, the company soon expanded its technology to space exploration, emanating from Roberto’s advanced training in adaptive optics, which inspired the design of a linear motor-driven control system for massive earth-based telescope installations. Enabling deep space exploration with colossal telescopes The European Southern Observatory (ESO) is an intergovernmental, ground-based astronomy research organization comprising 16 member states and is working with Microgate to build the adaptive mirror for the next and largest generation of Extremely Large Telescopes (ELTs). ELTs use primary mirrors with diameters in the 30-meter range – or in the case of the ESO-ELT an even more impressive 39meter diameter. The objective of these telescopes is to capture light from the Figure 1: Microgate builds the highly sophisticated adaptive-optics mirror for the ESO Extremely Large Telescope. The optics, powered by high-density DC-DC converter modules, correct for atmospheric disturbances to extract more light, achieving higher resolution imaging. Figure 2: ESO’s telescopes helped Andrea Ghez and Reinhard Genzel win the Nobel prize in Physics in 2020 for the discovery of the supermassive black hole in the Milky Way’s galactic centre. distant past to learn more about the early Universe. This requires a large primary mirror to collect the very few photons that can be captured from distant stars and galaxies. Unlike the Hubble or James Webb space telescopes, this Earth-based method of exploring the deep space has several advantages. According to The Astronomy Enthusiast, ground telescopes have an advantage of size – noting that the largest Earth-based telescope is 23 times larger than the Hubble. Ground telescopes can also be located anywhere on the planet and are easily upgradeable using the latest technology, while their counterparts in space are far more difficult to maintain and upgrade once launched. ESO’s existing telescopes have made possible several ground-breaking discoveries. For example, using the organization’s facilities, astronomers tracked the movement of stars in the extreme gravitational field at the center of our galaxy, delivering convincing evidence that a supermassive black hole exists there. This discovery was recognized with the 2020 Nobel Prize in Physics. Sophsticated adaptive optics compensate for wavefront aberrations enhancing visibility The ESO-ELT is situated atop Cerro Armazones in Chile’s Atacama Desert at an altitude of about 3,000 meters. The site
www.vicorpower.com POWER MODULES 15 www.power-mag.com Issue 1 2025 Power Electronics Europe selection for these installations was strongly dependent on the quality of visible light. This is because, as light passes through the atmosphere, it is subject to a disturbance known as a wavefront aberration. Using Microgate technology, the captured light is reflected from the primary to a secondary, adaptive mirror, which is physically deformed to re-establish what is known as a “plane” wavefront. In the case of the ESO-ELT project, Microgate delivers all of the real-time control hardware and software to mechanically deform the mirror and physically manipulate the incoming wavefront to correct for these atmospheric disturbances and improve the image quality. The ability to control the mirror’s geometric shape requires the use of contactless, linear voice-coil motors that conceptually are similar to a loudspeaker (see a short video demonstration). The adaptive mirror is 2.4 meters in diameter and is made of highly specialized glass with a thickness of 1.9 millimeters. The voice-coil motors are driven by a precise current driver and a series of colocated permanent magnets. These are glued to the back of the mirror and provide the force to deform the glass. This process is performed across the entire surface of the adaptive using 5,316 motors, each with an inter-axis distance, or pitch, of about 30 millimeters. The adaptive mirror physically floats on the magnetic field generated by the voicecoil motors. Each coil allows a dedicated control current to locally deform the mirror and correct the shape. This is achieved by using an equivalent number of highlysensitive capacitive, or position, sensors with an accuracy in the nanometer (millionth of a millimeter) range. Using electronics operating at a frequency of about 100 kHz, Microgate engineers can completely redefine the shape of the mirror in one millisecond. Once the gap has been measured, FPGA-based processors apply the correct commands to the mirror in real time and bring the control error to zero. The result is an extremely sharp and clean image that is rendered without having to launch a telescope into space. “The process requires extreme precision to correct the wavefront aberrations,” said Gerald Angerer, Microgate hardware development engineer. “As a result, we can improve the image resolution significantly.” High density power modules are mission critcal to honing adaptive optics The energy challenges to achieve such precision are considerable. For example, accurate thermal management of the adaptive optics system is critical and requires all exposed surfaces to be kept close to ambient temperature to avoid local turbulence. To compensate, Microgate uses a direct-expansion gas cooling system to thermally dissipate the motor-control electronics. Other cooling materials, such as water or glycol have been excluded, because even a small loss of coolant on the primary mirror could cause catastrophic damage to the entire telescope. The power challenge is made even more difficult by the limited space available for any power delivery solution, given the constraints imposed by housing thousands of motors in a confined space. A previous option required remote DC-DC converters to bring power to the motors with relatively long and complex wiring. To streamline the approach, Microgate chose the Vicor DCM3623 series DC-DC power module. The power-system board is now mounted on the underside of the gas-cooled cold plate, and each DCM3623 powers up to 36 motor channels, eliminating complicated wiring. “Vicor’s high-efficiency and high-power density modules are very compact and reliable and take up very little space on the circuit board,” said Angerer. “These miniaturized power converters are the best option for us. We have been using them for more than 10 years and there is currently no comparable substitute.” Vicor power modules deliver other benefits over alternative solutions: Power density: Vicor power modules are compact and extremely dense to meet the intense power demands of the ELT mirrors in a very confined space. Efficiency: The modules reduce energy losses created in the form of heat, helping to keep the temperature of the optical system stable. Too much heat could potentially degrade performance or distort optics. Fast transient response: The output voltage of Vicor modules remains stable within a wide frequency band, ensuring precise motor operation even under fast step-load variations. Figure 3: The secondary or adaptive mirror is made of highly specialized glass with a thickness of about 1.9 millimeters. The copper coils represent the linear motors. Figure 4: Microgate uses the Vicor DCM3623 seriea DC-DC power module to mechanically deform the miror and physically manipulate the incoming wave=front to correct for these atmospheric disturbances. This process is mission criticalto the telescopes optics to produce stronger light and ultimately higher image quality.
16 POWER MODULES www.vicorpower.com Issue 1 2025 Power Electronics Europe www.power-mag.com complex mirrors. Vicor power modules are enhancing the optics of these nextgeneration telescopes with high power density and reliability. Through a process of continuous experimentation, Microgate is collaborating with Vicor and other worldclass partners to deliver mission-critical power electronics to organizations like the European Southern Observatory. Low electromagnetic noise: EMI interference can disturb the focusing system, resulting in loss of image quality. Together exploring new frontiers of deep space to enrich our world Microgate is committed to deep space exploration through the instantaneous, precise manipulation of exceptionally “Unlocking the secrets of deep space is difficult,” said Angerer. “These new discoveries are re-writing our history books and redefining the way we think about the human race and where we fit into the Universe. It’s very challenging, and we are grateful to be working with some great partners to achieve our goals.” Brothers Roberto Biasi and Vinicio (RIGHT) To receive your own copy of subscribe today at: www.power-mag.com
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18 AUGMENTED REALITY IN ELECTRONICS MANUFACTURING https://ecelectronics.com/ Issue 1 2025 Power Electronics Europe www.power-mag.com 5 Key Uses for Virtual and Augmented Reality in Electronics Manufacturing In the rapidly evolving world of electronics, staying ahead of the curve is imperative. That’s why many electronics and original equipment manufacturers (OEMs) are investing more and more in new technologies, particularly in virtual reality (VR) and augmented reality (AR). Far from being merely futuristic concepts, these technologies are transforming the industry today, enhancing efficiency, accuracy and productivity across various stages of the manufacturing process. In fact, the global AR and VR market in manufacturing is projected to reach $88.4 billion by 2026, growing at a compound annual growth rate (CAGR) of 31.5% from 2023. This surge in adoption is driven by the benefits these technologies bring to the table — from improving quality control and maintenance to enhancing training, design and prototyping. Let’s delve into five significant applications of VR and AR in manufacturing, exploring their benefits and considerations… 1. Better prototyping and design AR and VR are transforming the design and prototyping stages by allowing engineers and designers to visualise products in 3D before they are built. VR can be used to create virtual prototypes that can be tested and modified in a virtual space, whereas AR can project design iterations onto physical objects — providing a hybrid view that combines the new designs with existing physical components. Benefits: Augmented and virtual reality technologies significantly reduce the time required to develop and refine prototypes. Cost savings. Electronics manufacturers and OEMs can cut down on the material costs associated with physical prototypes. These technologies facilitate better communication and collaboration amongst design teams, regardless of their location. Considerations: Technical skills. Before employees can start realising the full benefits of AR and VR for prototyping and design, they first need to be taught how to use these specialist design tools. Software integration. Ensuring compatibility with existing design and engineering software can be challenging. 2. Streamlined maintenance and repair Both augmented and virtual reality technologies can provide real-time, handsfree guidance for maintenance and repair tasks. Technicians can wear AR glasses that overlay instructions and diagrams directly onto themachinery they are working on. This can include step-by-step guides, realtime data from sensors and remote assistance from experts. Benefits: These technologies reduce human error by providing precise, real-time instructions.
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