PRODUCT UPDATE 21 www.power-mag.com Issue 2 2024 Power Electronics Europe New MOSFET redefines power density and efficiency in AI server power supplies MOSFET 400 V family, which is based on the second generation (G2) CoolSiC technology introduced earlier this year . Its claimed the new MOSFET portfolio was specially developed for use in the AC/DC stage of AI servers, complementing Infineon’s recently announced PSU roadmap. The devices are also ideal for solar and energy storage systems (ESS), inverter motor control, industrial and auxiliary power supplies (SMPS) as well as solid-state circuit breakers for residential buildings. The new family perportedly features ultra-low conduction and switching losses when compared to existing 650 V SiC and Si MOSFETs. Implemented in a multi-level PFC, the AC/DC stage of the AI Server PSU can attain a power density of more than 100 W/in? and is proven to reach 99.5 percent efficiency. This is an efficiency improvement of 0.3 percentage points over solutions using 650 V SiC MOSFETs. In addition, the system solution for AI Server PSUs is completed by implementing CoolGaN™ transistors in the DC/DC stage. With this combination of highperformance MOSFETs and transistors, the power supply can potentially deliver more than 8 kW with a claimed increase in power density by a factor of more than 3 compared to current solutions. The new MOSFET portfolio comprises a total of 10 products: five R DS(on) classes from 11 to 45 mΩ in Kelvin-source TOLL and D?PAK-7 packages with .XT package interconnect technology. The drain-source breakdown voltage of 400 V at T vj = 25°C. makes them ideal for use in 2- and 3-level converters and for synchronous rectification. The components offer high robustness under harsh switching conditions and are 100 percent avalanche tested. The highly robust CoolSiC technology in combination with the .XT interconnect technology enables the devices to cope with power peaks and transients caused by sudden changes in the power requirements of the AI processor. Both the connection technology and a low and positive R DS(on) temperature coefficient enable excellent performance under operating conditions with higher junction temperatures. www.infineon.com Developers of spacecraft electronics utilize radiation-tolerant (RT) field programmable gate arrays (FPGAs) to ensure high performance, reliability, power-efficiency and the best-in-class security for emerging space domain threats. To take it a step further and help provide fast, cost-effective software customization, Microchip Technology has introduced the Radiation-Tolerant PolarFire® SoC FPGA. Developed on Microchip’s RT PolarFire FPGA, it is the first alleged real-time Linux® capable, RISC-V-based microprocessor subsystem on a flight-proven RT PolarFire FPGA fabric. Developers can now potentially start designing using the commercially available PolarFire SoC (MPFS460) device and Libero® SoC development tools. Along with the company’s extensive Mi-V ecosystem, PolarFire SoC solution stacks, the PolarFire SoC Icicle Kit or the PolarFire SoC Smart Embedded Vision Kit, developing lower power solutions for the challenging thermal environments seen in space can happen today. Safety-critical systems, control systems, space and security applications need the flexibility of the Linux Operating System (OS) and the determinism of realtime systems to control hardware. RT PolarFire SoC FPGAs feature a multi-core Linux-capable processor that is coherent with the memory subsystem. The RT PolarFire SoC enables central satellite processing capabilities similar to those in single board computers which are common in the space industry for command and data handling, in platform avionics and in payload control. The SoC allows for flexible implementation of highly integrated designs, customization and evolution of function while improving size, weight and power considerations. For more information visit: www.microchip.com Offer Low Power, Zero Configuration Upsets, RISC-V Architecture for Space Applications With the increasing power requirements of Artificial Intelligence (AI) processors, server power supplies (PSUs) must deliver more and more power without exceeding the defined dimensions of the server racks. This is driven by a surge in energy demand of high-level GPUs, which could consume 2 kW and more per chip by the end of the decade. These needs, as well as the emergence of increasingly demanding applications and the associated specific customer requirements have prompted Infineon Technologies AG to extend the development of SiC MOSFETs to voltages below 650 V. The company is now launching the new CoolSiC™ New Energy-Saving DC-DC Converter ICs ROHM has developed four new compact DC-DC step-down converter ICs suitable for consumer and industrial applications, including refrigerators, washing machines, PLCs, and inverters. ROHM is expanding the lineup which includes the BD9E203FP4-Z, a 2A buck converter with switching frequency of 350kHz. In recent years, increasing application functionality in consumer devices and industrial equipment is driving the demand to minimize board space, resulting in a rise in the adoption rate of compact DC-DC converter ICs. Furthermore, as reducing standby power consumption is becoming a significant challenge, there is a growing need for DC-DC converter ICs to deliver higher efficiency during light load (low power) conditions. To meet
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