Power Electronics Europe April/May Issue 2022

9 www.power-mag.com Issue 2 2022 Power Electronics Europe MARKET NEWS technology. We are an IDM. However, we are different to other IDMs in that we can provide customers with a customized design and supply wafers. We can design devices according to the needs of our customers. We listen to what the customers tell us, and we design the devices for them, and we can then supply the wafers. And we can also agree to supply devices only to an individual customer – as long as there is enough volume to warrant it. PEE: GaN is used so far mostly in chargers and adapters for smart phones and coming notebooks, also LiDAR or other automotive applications are envisioned. What is missing are powertrain applications due to GaN voltage limitations. Do you expect to increase GaN BV levels in the near future in order to compete with SiC? And has Innoscience any activity to offer bulk GaN-on GaN in the future? DM: For automotive EVs, GaN is already in the laser driver for LiDAR sensor and low voltage DC/DC converter. We also expected GaN to penetrate the large onboard charger (OBC) market. That is something for which GaN is already suitable; we have a 650 volt device, and we feel that this is going to be the next GaN automotive application. Then, with regards to the power train beat, GaN is not there yet. Normally you need 1200 volt device to address such an application. You therefore have two solutions. The first one is to develop a multilevel converter; in that case, you need a low voltage GaN to achieve that. The second option is to really develop 1200 volt GaN, to really position GaN to compete with silicon carbide. My previous employer, IMEC (Belgian research institute) has shown that it’s possible to make 1200 volt lateral GaN devices on QST substrate. This is an interesting path that Innoscience will take a closer look at and compare it with a possible GaN-on-Si solution for 1200 volt. Regarding GaN on GaN bulking, that is also certainly interesting, technology-wise. The big limitation is the wafer size. The GaN wafers are limited to four-inch, that’s not compatible with our current manufacturing capabilities. The second point is the price of those bulk GaN wafers, which can be incredibly expensive. But that is also something we are open-minded about and we will keep monitor the market evolution of GaN bulk substrate. PEE: Aside from market research figures what is your expectation in the GaN market for the coming 5 years in order to justify huge investments in wafer processing equipment and packaging? At what ranking would you see Innoscience in this time frame, in 2021 its market share was estimated around 20 %? DM: Well, nobody has a crystal ball that’s for sure. But we think the GaN market will be booming – especially through greater penetration of the mobile phone market. This is one area we think will contribute to grow the overall volume of GaN dramatically. We also think GaN will penetrate elsewhere in the industry, in several consumer-type products, and eventually in the automotive sector too. We aim to produce 70,000 wafers per month, and that might not be even enough for the whole market. It’s fair to say that today many companies understood the benefit of GaN devices and we expect a big, big increase. We want to support the development of GaN technology and its wider adoption; we want to play our part in the development of an ecosystem. And our goal is to rank number one. That’s what we’re aiming. AS www.innoscience.com German-based SEMIKRON and Danfoss Silicon Power announced a merger to create a joint business specialized in Power Electronics focusing on power semiconductor modules and Silicon Cabide. With an existing workforce of more than 3,500 dedicated power electronic specialists, the new SEMIKRON-Danfoss will provide world-class technology expertise as the leading partner in Power Electronics. The merger comes with a firm commitment to future investments, paving the way for green growth and a more sustainable, energy efficient and decarbonized future. Electrical power will be in the future the most important energy source. The power semiconductor module is at the heart of all power electronic solutions. With the rise of e-mobility, the demand for electric vehicles is expected to increase by 30 % each year over the next years. This speaks to the enormous growth potential of power modules as they are a key component for powering the electric motor and in vehicle chargers. Industrial motors are consuming 50 % of electrical energy in the world and only 20 % of these motors are equipped with variable speed motor controls, leaving a large untapped potential to improve energy efficiency and reduce carbon dioxide emissions. The power module is the key component in any variable speed control for electric motors. The ongoing global transition aiming at replacing fossil fuels by improving energy efficiency and ambitious use of renewables also increases the demand for power modules. The power module is critical in all solar installations and all wind turbines to enable the power conversion to grids and energy storage. SEMIKRON-Danfoss will leverage its strong core business in industrial- and renewable power module applications and will utilize the partnership to target a leading position in Automotive power modules, and will set the trend and drive the technology shift into Silicon Carbide solutions in both industrial and automotive applications. The newly formed joint business will be owned by the current owner-families of SEMIKRON and the Danfoss Group, with Danfoss being the majority owner. The joint business will be operated in the accustomed manner, retaining existing production facilities in Germany, Nuremberg and Flensburg. The current factories and sales offices of Semikron and Danfoss Silicon Power will continue operations as usual. “With electrification driving the green transition, SEMIKRON-Danfoss aims to become the preferred decarbonizing partner for customers. We have the passion, competences and technologies to more than double our business in five years”, said Danfoss President & CEO Kim Fausing. “With the emerging technology transition from Silicon to Silicon Carbide, we are set to become the strongest partner of our customers and will inspire the future”, commented Claus A. Petersen, General Manager, Danfoss Silicon Power GmbH. “By combining our expertise as a pioneer for semiconductor technology with more than 70 years of experience in the development of top- class power modules and systems and the strength, innovativeness and fast-paced operations of Danfoss Silicon Power and the Danfoss Group we are positioned ideally to become one of the strongest players in power electronics”, added Karl-Heinz Gaubatz, CEO of SEMIKRON. www.semikron.com, www.danfoss.com SEMIKRON and Danfoss Silicon Power Join Power Module Forces Management team of the new SEMIKRON-Danfoss (left to right): Claus A. Petersen, General Manager, Danfoss Silicon Power GmbH; Dominik Heilbronner, Shareholder, SEMIKRON International GmbH; Karl-Heinz Gaubatz, CEO/CTO, SEMIKRON International GmbH; Jorgen Mads Clausen, Shareholder, Former Chairman of Danfoss A/S; Bettina Martin, Shareholder, SEMIKRON International GmbH; Dr. Felix Hechtel, Head of Supervisory Board, SEMIKRON International GmbH; and Kim Fausing, President and CEO, Danfoss A/S Photo: SEMIKRON-Danfoss