EV CHARGING Bringing the Cool to EV Charging ISSUE 4 – Oct/Nov 2025 www.power-mag.com Also inside this issue News | Market News | EV Charging Battery Management System | Power Modules Advancing Semiconductor Design Productronica 2025 Preview | SPS 2025 Preview Uninterruptable Power Supplies | Web Locator
Make sure you join the celebration... In this landmark 80th Anniversary year, the AEMT Awards will once again shine a spotlight on the people, companies, and innovations driving progress in the electro-mechanical sector. The awards recognise and reward the products, projects and services that play a crucial role in ensuring our food production, utilities, manufacturing processes, transportation and other essential services are maintained and secured. So whether you have submitted an entry or not, this is an industry event not to be missed. Produced by and operated by The Association of Electrical & Mechanical Trades 2025 Partners: AWARDS Book Seats at: www.aemtawards.com Kevin Keegan OBE To help celebrate this year’s industry awards evening, we are thrilled to have Kevin Keegan providing the entertainment. An incredibly passionate and renowned communicator, Kevin is one of the most recognisable faces in British football. His illustrious playing career includes stints at Liverpool, Hamburg, Southampton, and Newcastle, as well as an iconic tenure with the England national team, where he captained the side for six years before retiring after the 1982 World Cup. As a manager he held the reins at Newcastle, Fulham, Manchester City, and even the England national team. Beyond his playing and managerial career, he is also a highly respected broadcaster. We’re excited to have Kevin with us this year, and we’re sure his insights and passion will add a unique spark to the celebration. The Parachutes The Parachutes combine impressive voices with a guitar and a drum kit, creating the illusion of a much larger ensemble. With a floor-filling mix of indie, pop, rock, soul, funk and Motown tracks from throughout the years in their repertoire, they’re experts at keeping guests of all ages dancing late into the night.
CONTENTS www.power-mag.com Issue 4 2025 Power Electronics Europe 3 News & Features Editor Leslah Garland Tel: +44 (0)1732 370340 Email: leslah.garland@dfamedia.co.uk Publisher Damien Oxlee Tel: +44 (0)1732 370342 Email: damien.oxlee@dfamedia.co.uk www.power-mag.com Production Editor Chris Davis Tel: +44 (0)1732 370340 Email: chris@dfamedia.co.uk Financial Manager Joanne Morgan Tel: +44 (0)1732 370340 Email: accounts@dfamedia.co.uk Reader/Circulation Enquiries Perception Tel: +44 (0) 1825 701520 Email: cs@perception-sas.com INTERNATIONAL SALES OFFICES Mainland Europe: Victoria Hufmann Norbert Hufmann Tel: +49 911 9397 643 Fax: +49 911 9397 6459 Email: pee@hufmann.info Eastern US Damien Oxlee Tel: +44 (0)1732 370342 Email: damien.oxlee@dfamedia.co.uk Western US and Canada Damien Oxlee Tel: +44 (0)1732 370342 Email: damien.oxlee@dfamedia.co.uk Japan: Yoshinori Ikeda, Pacific Business Inc Tel: 81-(0)3-3661-6138 Fax: 81-(0)3-3661-6139 Email: pbi2010@gol.com Taiwan Prisco Ind. Service Corp. Tel: 886 2 2322 5266 Fax: 886 2 2322 2205 Circulation and subscription: Power Electronics Europe is available for the following subscription charges. Power Electronics Europe: annual charge UK/NI £95, overseas $160, EUR 150. Contact: DFA Manufacturing Media, 192 High Street, Tonbridge, Kent TN9 1BE Great Britain. Tel: +44 (0)1732 370340. Refunds on cancelled subscriptions will only be provided at the Publisher’s discretion, unless specifically guaranteed within the terms of subscription offer. Editorial information should be sent to The Editor, Power Electronics Europe, 192 High Street, Tonbridge TN9 1BE U.K. The contents of Power Electronics Europe are subject to reproduction in information storage and retrieval systems. All rights reserved. No part of this publication may be reproduced in any form or by any means, electronic or mechanical including photocopying, recording or any information storage or retrieval system without the express prior written consent of the publisher. Printed by: Warners. ISSN 1748-3530 PAGE 4 News PEE looks at the latest News and company developments PAGE 7 Market News PAGE 10 The importance of hardware emulation when developing a next-generation automotive BMS PAGE 12 Power modules simplify creepage and clearance design solutions for electric vehicles Why overmolding is the key to solving arcing issues in 48V automotive power systems PAGE 16 Advancing semiconductor design through wide-bandgap engineering By Chinmoy Baruah, Founder and CEO at CHIPX PAGE 18 Highlights at productronica 2025 Just a short while to go before the anniversary edition of productronica. The world’s leading trade fair for the development and production of electronics celebrates its 50th anniversary this Autumn. From November 18 to 21, Munich will once again be the meeting place for the international electronics industry. productronica 2025 will focus on advanced packaging, power electronics and trusted microelectronics. As in previous years, SEMICON Europa will be co-located with productronica at the Messe München exhibition centre. The conceptual sponsor of productronica is the industry association VDMA Productronic. PAGE 22 SPS 2025 to focus on AI and talent development PAGE 26 Protection Needs for Uninterrupted Power Supply Sub-Circuits PAGE 29 Web Locator Bringing the Cool to EV Charging Steve Drumm, Strategic Marketing Manager – Solutions in Energy, OMRON Electronic Components Europe B.V., explains how consumer, commercial and industrial AC EV chargers can get cooler, smaller, and longer lasting. More details on page 8. FEATURE STORY Subscribe for your FREE copy now
4 NEWS Issue 4 2025 Power Electronics Europe www.power-mag.com Alpha and Omega Semiconductor (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, has announced support for the power requirements of the innovative 800 VDC architecture announced by NVIDIA. This architecture is set to power the next generation of AI data centres, which will feature megawatt-scale racks to meet the exponential growth of AI workloads. The shift from traditional 54V power distribution to an 800 VDC system is a fundamental change in data centre design, aimed at overcoming the physical limits of existing infrastructure. By reducing power conversion steps and enabling more efficient power delivery, the 800 VDC architecture promises significant efficiency gains, reduced copper usage, and improved reliability. This paradigm shift requires advanced power semiconductors, particularly Silicon Carbide (SiC) and Gallium Nitride (GaN), to handle the higher voltages and frequencies with maximum efficiency “As a key supplier to the high-performance data centre market, our portfolio of SiC and GaN products is strategically aligned with the core technical demands of next generation AI factories with 800 VDC power architecture,” said Ralph Monteiro, Sr. VP, Power IC and Discrete Product lines at AOS. “We are collaborating with NVIDIA to design 800 VDC power semiconductors to provide the high efficiency and power density necessary for the new power distribution modules, from the initial AC-to-DC conversion to the final DC-toDC stages within the racks.” AOS says its expertise in developing and manufacturing wide bandgap (WBG) semiconductors positions it as a strong enabler for this transition. The company’s products are well-suited for the crucial power conversion stages highlighted in the next generation AI factory 800 VDC power architecture: High-Voltage Conversion: AOS’ SiC devices, including the Gen3 AO020V120X3 or topside cooled AOGT020V120X2Q, offer superior voltage handling and low losses, making them ideal for either the power sidecar configuration or the single-step conversion of 13.8kV AC grid power directly to 800 VDC at the data centre perimeter. This simplifies the power chain and enhances overall system efficiency. High-Density DC-DC Conversion: Within the racks, AOS’ 650V GaN FETs, like our upcoming AOGT035V65GA1, and our 100V GaN FETs like AOFG018V10GA1 provide the required density essential for converting the 800 VDC power to the lower voltages needed by GPUs. Their high-frequency switching capabilities allow for smaller, lighter converters, freeing up valuable space for more compute resources and improving cooling efficiency. Packaging Innovations: AOS’ 80V, 100V stacked-die MOSFETs like AOPL68801, and 100V GaN FETs share a common package footprint, allowing designers to trade off cost and efficiency in the secondary side of LLC topologies and also in 54V to 12V bus converters. AOS’ innovative stacked die packages enable next-level power density for the secondary side LLC socket. Multiphase Controllers: AOS also offers high-performance, multi-rail 16phase controllers for the 54V to 12V and further downstream conversion stages to the AI SoC. By providing these foundational power technologies, AOS says it is helping to advance the benefits of the 800 VDC architecture, including up to a 5% improvement in end-to-end efficiency, a 45% reduction in copper requirements, and a significant cut in maintenance and cooling costs and this reinforces AOS’ commitment to enabling the creation of more sustainable and scalable AI infrastructure. www.aosmd.com Alpha and Omega Semiconductor Supports 800 VDC Power Architecture for Next-Generation AI Factories with Innovative SiC and GaN, Power MOSFET, and Power IC Solutions Molex Announces Availability of Industry-First, Space-Saving Quad-Row Board-to-Board Connectors with EMI Shields Molex, a global electronics leader and connectivity innovator, has announced availability of the Molex Quad-Row Shield Connector, said to feature the industry’s first space-saving, four-row signal pin layout with a metal electromagnetic interference (EMI) shield. The company says the Quad-Row Shield Connector achieves up to 25dB reduction in EMI compared to non-shielded Quad-Row, and is ideally suited for space-constrained applications, such as smart watches and other wearables, mobile devices, AR/VR applications, laptops, gaming devices, appliances and more. “Without shielding, connectors can be vulnerable to external electromagnetic noise from nearby components or far-fielded devices, causing signal degradation, data errors and system malfunctions—especially in high-speed or sensitive applications,” said Taekeon Park, Director, Micro Connectors, Molex. “In the past, designers would build additional external shielding or complex grounding solutions into devices to mitigate the issue—compounding complexity, size and cost. Quad-Row Shield removes those design and performance hurdles by ensuring enhanced reliability and signal integrity, as well as design flexibility and space optimization.” The new Quad-Row Shield builds on the market-proven, Quad-Row layout with the addition of an EMI shield that mitigates both electromagnetic and radio frequency (RF) interference, as well as signal integrity issues that create undue noise, achieving up to 25dB reduction in EMI over the non-shielded Quad-Row solution. The new, built-in EMI
NEWS 5 Power Electronics Europe Issue 4 2025 Power Electronics Europe shield is a critical value-add for device designers striving to ensure stable, error-free signal performance in space-constrained device designs. Molex says its long-standing collaboration with product developers from major device and gaming manufacturers supports continued enhancements, including the development of the new EMI shielding. Together, Molex and its customer engineering teams addressed the most significant requirements related to signal interference and incremental power requirements, specifically how best to achieve 80 times the signal connections and four times the power delivery compared to a single-pin connector. The new Quad-Row Shield provides power input and output aligned to a delivery model featuring up to 80 pins within a single board-to-board connector. In addition, S-parameter input specifications may be assigned to a preferred pin layout in an 80-pin signal design. The highly innovative Quad-Row Shield significantly reduces electromagnetic interference and meets stringent EMI/EMC standards to lower regulatory testing burdens and speed product approvals. The shielding feature also enables error-free communication while seamlessly supporting operations and maintenance requirements to boost overall system uptime. https://www.molex.com/en-us/home Danfoss Power Solutions has announced the launch of CAN 2 Current (C2C), a compact solenoid-mounted microcontroller designed to work with Danfoss cartridge valves, hydraulic integrated circuits (HICs), hybrid PVG/HIC valves, and open-circuit pumps. C2C connects the valve, HIC, or pump to the controller area network (CAN) bus, enabling accurate and efficient component actuation as well as simple diagnostics. The company says C2C is a high-performance device delivering repeatable and consistent control. The device communicates using CAN bus protocols to provide closed-loop current control on one or two outputs. C2C can be used with on/off and proportional solenoids and is available as either a single- or dual-channel device. The singlechannel device commands one coil while the dualchannel device can command two coils sequentially. It is compliant with ISOBUS and SAE J1939 communication protocols. C2C can maximise energy efficiency through peak-and-hold control technology. This feature reduces current in the hold phase to only the power required to maintain the solenoid’s position, thus holding the function. Using retention current on extended-hold functions, such as clamping, reduces energy consumption by up to 70%. This minimises cooling needs and may reduce the battery capacity required in some types of batteryelectric machinery. The controller’s compact, robust design maximises space efficiency as well as durability. C2C features resin-potted construction that offers protection from dust and dirt, as well as shock and vibration resistance. With its IP67 ingress Danfoss Power Solutions launches CAN 2 Current, a solenoidmounted microcontroller for accurate, efficient component actuation protection rating, C2C is built to last in harsh offhighway environments. By connecting the valve or pump to the CAN bus, C2C simplifies diagnostics. The CAN bus enables real-time communication between the C2C and the machine controller, enabling status messages to be shared with the operator via cabin display. This eliminates the need for manual troubleshooting to identify solenoid issues. “With CAN 2 Current now part of our portfolio of closed-loop current control actuators, Danfoss can deliver a truly fantastic, complete subsystem with all the benefits of CAN bus. Our full portfolio of solutions addresses every requirement, delivering functionality perfectly matched to the machine,” said Michael Hartmann Andresen, Global Product Portfolio Manager, Actuators, Danfoss Power Solutions. “We aim to develop the strongest actuator platform on the market. We will continue to build out our closed-loop CAN actuator portfolio while not forgetting the need for durable, reliable open- and closed-loop analogue actuators.” C2C offers quick and simple setup. The full Danfoss Power Solutions actuator portfolio features a standardised approach for setup and control, which is applicable across C2C and PVE configurations for various valve solutions. The actuators are configured within the PLUS+1 Service Tool, offering a familiar, easy-to-use setup platform. The C2C device’s configurable parameters include communication time guarding, dither, minimum and maximum current, and hold current. https://www.danfoss.com/en-gb/
6 NEWS Issue 4 2025 Power Electronics Europe Power Electronics Europe Anritsu Company has announced it has launched the MN4765B-0140 O/E Reference Calibration Module, said to be the world’s fastest and first traceable solution to support the testing demands of next-generation data centres and the explosive growth of Artificial Intelligence (AI) and Machine Learning. As data centres transition from 224 Gbps to 448 Gbps per lane to achieve total data rates like 1.6T, the required bandwidth for electrical-optical (E/O) modulators and optical-to-electrical (O/E) photodetectors now exceeds 130 GHz. The new MN4765B-0140 is engineered to meet this critical need, pushing the measurement frontier to 145 GHz. The company says the MN4765B-0140 is a monumental step forward for high-speed component verification: World’s First 145 GHz Reference Photodetector: It offers the widest commercially available frequency range from 70 kHz to 145 GHz for O/E calibration at the 1550 nm wavelength, enabling the high-confidence characterization of cutting-edge E/O and O/E devices. Traceability to 145 GHz: Anritsu secured traceability for the new module to a recognized National Metrology Institute. This is a crucial differentiator, as existing standards from NIST are limited to 110 GHz, making the MN4765B-0140 the only solution providing verifiable measurement accuracy at these extreme bandwidths. Unique, Cost-Effective System Solution: When integrated with Anritsu’s VectorStar ME7838D 145 GHz Vector Network Analyzer (VNA), the combination creates the world’s only complete, traceable, and flexible system for testing the entire high-speed opto-electronic ecosystem, including TOSA, ROSA, BOSA, and Coherent Optical Sub-Assemblies (COSA). Anritsu says its solution provides significant advantages over competing systems, which typically forces customers into a more expensive solution lacking the necessary 145 GHz reference calibration module entirely. “The AI revolution is demanding a massive leap in data centre interconnect speeds, making the 145 GHz bandwidth non-negotiable for 1.6T deployment,” said a spokesperson for Anritsu Company. “The MN4765B-0140 eliminates measurement uncertainty at these critical frequencies. Coupled with the flexible and futureproof VectorStar VNA platform, our customers gain a powerful, cost-effective tool that secures their investment by offering a simple upgrade path and superior measurement speed.” https://www.anritsu.com/en-gb/ Toshiba Electronics Europe has announced it has expanded its range of Zener diodes with the launch of a further 15 products. These devices will be used to protect the power lines of semiconductor devices and equipment from switching surges and long duration overvoltage pulses. They will be useful in a wide range of applications, including consumer and industrial. The company says the new CMZBxxA series products feature a planar structure and are designed as successors to the mesa-structured CMZBxx series products, which have been announced as reaching end of life (EOL). The innovative planar structure enables a low reverse current and high reliability as the PN junction is protected with oxide film. Additionally, fine process adjustments ensure a reduced variation in the Zener voltage between devices. The new products feature protection against transient overvoltage pulses, and also against long duration overvoltage pulses, which are usually difficult for ESD protection diodes to handle. In power lines of equipment, switching surges with long pulse widths of up to milliseconds may be generated when the circuit switches. The new Zener diodes can protect semiconductor devices from switching surges and overvoltage pulses close to DC. Compared to the CMZBxx series, the new products can improve the specification range of Zener voltage from ±10% (typ.) to ±5% (typ.) and the maximum reverse current (IR) from 10 A to 0.5 A. These improvements help to simplify equipment design and reduce overall power consumption. Additionally, as the new CMZBxxA devices use the same M-FLAT (2.4mm x 4.7mm x 0.98mm) package as the existing CMZBxx series, upgrading does not require any PCB layout changes. The 15 products in the lineup cover a range of Zener voltage (Vz) from 12V (typ.) to 51V (typ.), supporting a wide range of commonly used voltages. The new products help to improve equipment reliability by providing surge protection for power supply lines. https://www.toshiba.eu/ Toshiba launches a range of 15 new Zener diodes for protection of power lines Anritsu Breaks Bandwidth Barrier with World’s First 145 GHz O/E Calibration Module, Accelerating 1.6T Data Center Evolution
MARKET NEWS 7 Power Electronics Europe Issue 4 2025 Power Electronics Europe In just a few years, the European Commission’s Ecodesign for Sustainable Products Regulation (ESPR) has gone from a distant policy discussion to an urgent priority for the electronics industry, one that companies must address now or risk falling behind. Having originally come into play in mid-2024, with the ultimate goal of making sustainable and circular products the norm in the EU, electronics companies that are due to be impacted (those who either sell into or are based in the EU market) have been getting to grips with the regulations’ varied intricacies. In particular, the regulation mandating Digital Product Passports (DPPs). Given the electronics sector’s highly complex supply chains and the heightened scrutiny it faces due to the significant volume of e-waste it produces, achieving compliance represents a considerable challenge. The EU’s strong focus on this industry is understandable when we realise that, in 2022 alone, Europeans generated, on average, 17.6 kg of e-waste per capita, and out of that, approximately 7.5 kg per person was formally collected and recycled. For electronics businesses looking to stay ahead of regulation and position themselves for a more sustainable future, three upcoming milestones are particularly important to track. With the electronic sector’s uniquely complex supply chain considerations and added scrutiny it receives due to the amount of e-waste it generates, the sector has an extensive task ahead when it comes to compliance. The EU’s circularity push and Energy Labelling Working Plan (Released in April 2025) Since the EU’s ESPR came into force last year, affected industries have been navigating a complex path, seeking clarity on next steps. To address this, the EU released its first Energy Labelling Working Plan in April 2025, outlining horizontal requirements across sectors. Key areas include repairability scores (likely covering consumer electronics), recycled content, and recyclability of electronic equipment. The Working Plan says that every product for which ecodesign measures will have to be adopted will have a DPP (a digital record of information about the product), to open up data access for businesses, consumers, and public authorities. Knowing early on that this will be mandatory allows electronics providers to start developing strategies for deploying DPPs, identifying where the necessary data resides, and engaging with DPP solution providers. The Delegated Acts and Horizontal Requirements (Between 2027 and 2029) By 2027, the EU is expected to have outlined its first set of delegated acts for certain product groups - these will provide guidelines detailing the exact requirements for the data needed in DPPs. Timelines will vary by industry; some won’t see finalised details until 2028 or later. For electronics providers, it will be the horizontal requirements (due between 2027 and 2029) that will be the most relevant. These rules are expected to cover specifications such as product carbon footprints and instructions for recycling or safely disposing of hazardous components. Companies that want to stay ahead should already be mapping where the necessary data sits within their business and supply chain, defining an implementation strategy, and preparing to run pilots with trusted partners. Compliance deadlines are looming (Expected 18 months after the delegated acts) Electronics manufacturers should anticipate that compliance will be required within roughly 18 months of the relevant delegated act being published. The European Commission may also choose to shorten this timeframe in cases of environmental urgency or to align with broader EU policy goals. This period should not be seen as a grace window, but as the final phase for perfecting DPP strategies. By then, companies will be expected to move beyond pilots and deliver full-scale implementation with confidence. Industries earlier in the queue, such as iron and steel, which are likely to see delegated acts in 2026, will serve as valuable case studies. Their experiences will provide useful lessons that electronics businesses can apply to strengthen their own compliance readiness. Although the deadlines may seem distant, they are expected to take effect approximately 18 months following the adoption of the delegated acts. Each milestone presents an opportunity for the electronics sector to reduce risks, adapt proactively, and ensure regulatory compliance well ahead of the cutoff date. https://www.protokol.com/ The Electronics industry and getting ESPR Compliant: Three moments to consider By Matthew Ekholm, Digital Product Passport and Circularity Specialist at Protokol To receive your own copy of Power Electronics Europe subscribe today at: www.power-mag.com
8 EV CHARGING http://components.omron.com/eu-en Issue 4 2025 Power Electronics Europe www.power-mag.com Bringing the Cool to EV Charging Steve Drumm, Strategic Marketing Manager – Solutions in Energy, OMRON Electronic Components Europe B.V., explains how consumer, commercial and industrial AC EV chargers can get cooler, smaller, and longer lasting. EV-Charger Design Challenges The ongoing shift toward electrification holds the promise of cleaner and more energy-efficient living. On the other hand, end-user expectations continue to drive demand for more compact equipment that fits neatly and stylishly into lives and living spaces while also delivering higher performance. These demands for smaller, slimmer, and faster apply to everything, from accessories and small appliances to power adapters and chargers including electric vehicle service equipment (EVSE). High-power EVSE wallboxes are an increasingly common sight in today’s homes and businesses. These support Mode 3 charging, which stipulates built-in control and protection functions for safety, and can charge an EV at up to 22kW from a three-phase AC supply. By providing convenient access to safe and secure charging, ideal for use overnight or during the working day, these wallboxes can certainly help dispel the speed of charge and range anxiety often cited as the main reasons for motorists’ reluctance to adopt EVs as daily transport. On the other hand, size and aesthetics are highly important and become a key differentiator between manufacturers. However, cramming the circuitry into the smallest and thinnest possible enclosure brings thermal management challenges that must be addressed to ensure the long-term reliability of the EVSE as well as user safety. Wallboxes like these could be in continuous use or may be connected to several vehicles in rapid succession, especially when installed in a workplace scenario, giving little or no opportunity to cool down between charges. In direct sunlight, the internal temperature can easily reach 70-80˚C, and cycle through 50-60˚C variances within the space of a couple of hours. While units equipped with temperature sensors can throttle the charging current in overtemperature conditions, which is good for safety, this means slower charging rates and less convenience for the end user. On a particularly hot day, or if a fault is causing the wallbox to overheat, the charger may not be able to function at all. Addressing these thermal challenges can enhance reliability, safety, and the user experience. Self-Heating Effects Within the wallbox circuitry, resistive components, power transistors, inductors, transformer windings, cables, and connectors exhibit self-heating due to power dissipation that increases with the square of the current flowing (I2R). A surprising amount of I2R-related heat in the wallbox is associated with the contact resistance of the main switching device, which is usually an electromagnetic relay or contactor. Unlike power transistors, which can be connected in parallel to distribute load current, paralleling electromagnetic switches is impractical. As the full load current must pass through the relay, the contact resistance when closed has a considerable heating effect. Even a one milliohm increase in the relay contact resistance can equate to as much as *18˚C in increased load terminal temperature rise. Excessive heat dissipation within the enclosure is undesirable, of course, and also mitigates against achieving slimmer and more compact wallbox designs. For a given heat load, a small-sized enclosure has less surface area from which to dissipate heat and so will experience a higher temperature rise. In addition, packing components more tightly in the
ttp://components.omron.com/eu-en EV CHARGING 9 www.power-mag.com Issue 4 2025 Power Electronics Europe compact space can restrict airflow and lead to localised hotspots. Extra thermal management, possibly including heatsinks, increased ventilation, or active cooling such as a fan, may be required. However, this will increase the wallbox cost and complexity. Moreover, a fan can be noisy and compromises the overall reliability. Relay Evolution Lowering the heat load resulting from the electrical components, including the relay contacts, can break this impasse and allow designers more freedom to reduce the wallbox dimensions. Advancements from the cutting edge of relay design now enable compact new relays in PCB-mount form factors that combine high current capability with low contact resistance, resulting in lower dissipation and reduced temperature rise. Historically, PCB relays have been best suited to applications up to about 25 A. For higher currents, designers have tended to specify contactors, which are typically off-board, DIN rail-mount components fitted with screw terminals. The latest PCB relays introduce new features to handle current significantly above 25 A and can replace traditional contactors in equipment such as high-power industrial systems and utility-grade power conditioners. Among new high-power relays emerging as a result of this trend, the Omron G9KC series has a guaranteed initial contact resistance of less than 6 milliohms - roughly half that of any equivalent solution on the market - and contains features optimised for AC wallbox applications. As well as improving charging efficiency and performance, the ultra-low resistance at full load (32A per live phase) significantly reduces hotspots caused by flowing current and reduces the likelihood of current throttling. The reliability and longevity of the relays themselves, as well as surrounding components are also improved. Crucially, the relay retains a low contact resistance throughout its lifetime. This is particularly important given that wallboxes are typically expected to remain in service for several years or more. At the heart of the G9KC is a purpose developed mechanically coupled doublebreak contact design providing class leading endurance due to its enhanced contact card (cradle) structure that significantly improves energy efficiency while reducing heat dissipation. As a result, with good overall charger design, operating temperatures in a typical 22 kW 32 A wallbox can be reduced by as much as 10˚C. This not only facilitates faster, more efficient charging, but also unlocks new possibilities for wallbox designers to develop more compact and robust designs. With a 4mm main contact gap and 10 kA short circuit capability, tested according to IEC62955 (TUV approved), the G9KC exceeds the requirements of the upcoming Electric vehicle conductive charging system Standard IEC 61851 ED4. Moreover, with its compact 4-pole structure, the G9KC can replace larger multi-pole contactors or up to four individual single-pole relays. This useful combination widens the scope of applications to include Behind the Meter (BTM), inside EV Charger and In Front of Meter (FTM). Conclusion While Mode-3 chargers offer convenience and safety to address EV range anxiety, charging infrastructure must continue improving to accommodate the rapidly growing EV market. Using more thermally efficient components could let designers add more functionality, such as extra sensors to monitor charging speeds, while further new developments could include wireless charging. On the other hand, thermal management will continue to be one of the most critical design challenges governing wallbox size, shape, efficiency, reliability, and safety. The latest developments in relay technology contribute towards enabling new designs to be unobtrusive and easily installed, as well as ensuring more efficient charging. *Reference Thermal Simulation conditions: 32A carry current on three load terminals. T.Amb.85?. PCB evaluation board (2 layers of 10 mm wide, 0.3 mm depth copper foils) For more information on the G9KC, please visit: https://components.omron.com/euen/products/relays/G9KC http://components.omron.com/eu-en https://www.linkedin.com/company/om ron-electronic-components-europe-b-v-/ Fig 1_Image of mechanically coupled 4-pole structure.jpg
10 BATTERY MANAGEMENT SYSTEM https://www.ti.com/ Issue 4 2025 Power Electronics Europe www.power-mag.com The importance of hardware emulation when developing a next-generation automotive BMS In the competitive landscape of vehicle electrification, one thing that original equipment manufacturers (OEMs) cannot compromise on is safety and reliability in hybrid and electric vehicles. The vehicle’s battery management system (BMS) is indispensable for achieving safety and reliability by: Avoiding cell failures. Detecting and reacting to failures quickly through cell and environmental sensor supervision. Continuously monitoring isolation within the vehicle’s high-voltage system. Estimating the vehicle range. Assessing the maximum power for charging or driving. Extending the driving range based on battery pack capacity. Increasing the amount of battery cycles before a battery pack needs to be replaced or recycled. While demands for higher levels of BMS reliability have increased, so has the need for faster development cycles. Given the complexity of these types of systems, OEMs are seeking closer collaboration with system developers, semiconductor companies and their third-party partners to streamline development. Figure 1 shows an example of an electric vehicle (EV) BMS. This collaboration is evident in the software-based simulation capabilities used during BMS development, during which components and systems are tested in both normal and excessive conditions early in the development cycle without physical hardware or an expensive testing space. Tools such as hardware-in-the-loop simulators can emulate a battery module or pack, enabling accelerated development, compact test setups, virtual prototyping, automatic testing, and the ability to develop software for the BMS without a physical battery pack. By simplifying the testing process, emulators can play an important role in accelerating innovation in the BMS field. The advantages of using emulators when developing an automotive BMS Hardware-in-the-loop solutions provide a safe way to simulate the two-pole behavior of battery cells, modules or packs. The output of real, high-precision voltages for all cells is referred to as voltage-level hardware-in-the-loop testing. It is also possible to test the BMS main controller at the signal level and simulate the battery cells and cell supervision units (CSUs). The focus in this approach is to test the functions of the BMS controller and its interaction with the vehicle network (or any other environment) without using actual high voltages. This provides a deeper representation toward the final hardware and is referred to as an emulator. Emulation of both the entire battery pack (or module) and the cell and pack monitors allows for deep and repetitive testing. For example, you could test in the very early development stages using a simulated integrated circuit like the BQ79616-Q1 battery monitor. Another potential use case for testing the BMS controller at the signal level is integration testing with other control units, such as motor controllers or onboard chargers. The functionality of a BMS emulator The dSPACE Cell Controller Virtualization (CCV) can perform comprehensive signallevel BMS testing of cell controller functions without the need for complete hardware, and without high-voltage safety equipment (as shown in Figure 2). One of the advantages of a BMS testing emulator like the dSPACE CCV is that it enables you to conduct tests outside of an expensive, often-booked high-voltage lab environment. Compared to high-voltage Figure 2. Diagram of battery cell, CSU and communication with the main BMS controller simulation when using the dSPACE solution for signal-level BMS testing Figure 1. Typical BMS and battery in an EV
https://www.ti.com/ BATTERY MANAGEMENT SYSTEM 11 www.power-mag.com Issue 4 2025 Power Electronics Europe BMS testing, a signal-level approach provides benefits in terms of price efficiency and a more compact test system footprint. Since signal-level testing doesn’t require any real cell voltages, the test systems are less complex and require fewer safety installations. Signal-level testing also offers design flexibility. Testing system functions early allows designers to focus on optimization even before the real battery or battery pack monitoring hardware (like the CSU) becomes available. And beyond just simulating the cell controllers, the dSPACE solution can also emulate communication with the main BMS controller, the vehicle electronic control unit, real-time test computers, or vehicle hardware. Typical use cases of the dSPACE cell controller virtualization solution include running integration tests on the main BMS controller to validate its communication with other vehicle control units, such as the e-motor controller (inverter) or the onboard charger in hybrid and electric vehicles. You can also test state-of-charge and state-of-health algorithms for fault detection and reaction, and conduct integration tests on a system or on a full vehicle hardware-in-the-loop simulator. These emulators are based on powerful field-programmable gate arrays (as shown in Figure 3) and are able to meet demanding timing requirements. They support a wide range of communication protocols, for fast, safe and isolated communication. This enables more flexible testing capabilities, such as connecting the emulated battery pack to the battery management unit in a hybrid emulated/real hardware environment. Conclusion After two decades of automotive BMS innovations, it’s exciting to see corresponding advancement in emulation solutions. By emulating TI battery management ICs, the dSPACE cell controller virtualization solution helps facilitate system development earlier in the design process. An expedited process enables software to progress before hardware is available and tests real-life or extreme conditions to help enhance system safety and reliability. Texas Instruments https://www.ti.com/ Figure 3. Overview of dSPACE CCV solution for testing BMS at the signal level Name: Company Name: Address: Post Code: Tel: Total Number of Copies @ £ p+p Total £ Drives S & S Hyd H/B Pne H/B Ind Mot Comp H/B H/B Air QUANTITY QUANTITY Hydraulics & Pneumatics There are now 6 of these handy reference books from the publishers of the Drives & Controls and Hydraulics & Pneumatics magazines. Published in an easily readable style and designed to help answer basic questions and everyday problems without the need to refer to weighty textbooks. We believe you’ll find them invaluable items to have within arms reach. From the publishers of QUANTITY QUANTITY QUANTITY 2-5 copies £4.30, 6-20 copies £4.10, 20+ copies £3.75. QUANTITY PRACTICAL ENGINEER’S HANDBOOKS HYDRAULICS INDUSTRIAL MOTORS SERVOS AND STEPPERS PNEUMATICS COMPRESSED AIR INDUSTRIAL ELECTRIC DRIVES PLEASE ALLOW UPTO 28 DAYS FOR DELIVERY $&! -!.5&!#452).' -%$)! ,4$ 4HE (IGH 3TREET 4ONBRIDGE +ENT 4. "% Postage and Packaging: 1-3 copies: £2.99 4-6 copies: £4.99 7 or more copies: £6.99 If you would like to obtain additional copies of the handbooks, please email info@dfamedia.co.uk or call us on 01732 370340. Alternatively you can return the completed form below to: Engineers Handbook, DFA MANUFACTURING MEDIA LTD, 192 The High Street, Tonbridge, Kent TN9 1BE #HEQUES SHOULD BE MADE PAYABLE TO $&! -ANUFACTURING -EDIA ,TD AND CROSSED ! # 0AYEE #OPIES OF THE HANDBOOKS ARE AVAILABLE AT a PER COPY $ISCOUNTS ARE AVAILABLE FOR MULTIPLE COPIES
12 POWER MODULES https://www.vicorpower.com/ Issue 4 2025 Power Electronics Europe www.power-mag.com Power modules simplify creepage and clearance design solutions for electric vehicles Why overmolding is the key to solving arcing issues in 48V automotive power systems Arcing is not a new problem for electrical engineers, but if overlooked it can have next five years. Emerging as a front runner for this new architecture, the higher voltage of an 800V battery demands greatly increased creepage and clearance distancing, generating challenges in the size and spacing of electrical systems. Higher voltage power drives increases in component spacing necessary to prevent electric breakdowns (arcing). Vehicle life expectancy is about two decades with proper creepage and clearance design, but much shorter if arcing is not properly accounted for in the design phase. Arcing can cause electric components to degrade over time possibly creating safety issues. OEMs now face two key issues related to creepage and clearance requirements that must be addressed. 1: New creepage and clearance considerations for 48V 2: Greater risk caused by 48V architecture compared to the legacy 12V architectures What should design engineers be aware of for proper creepage and clearance in a 48V PDN? Creepage and clearance requirements are extremely important safety measures that Figure 1 Conversion to a 48V bus reduces the vehicle’s total current draw from over 250A to under 75A without impacting the electrical content of the vehicle. Since 1908, the current demand in automobiles has grown exponentially with the addition of vehicle electronics. In the 1960s OEMs increased voltage from 6V to 12V, causing current to drop for the first time in 60 years. Today, most OEMs still use the 12V bus but are rapidly converting to 48V out of necessity to accommodate an influx of high-power electronics. Figure 2 Creepage and clearance requirements are international safety measures to mitigate the risk of arcing. These requirements must be met to ensure safety and functionality. Lack of proper distancing may result in excess heat, directly damaging or compromising the power delivery network. Higher voltage requires up to 60% greater space in between components. This additional spacing can consume substantially more board space, enlarging the entire power system design which is problematic for most systems with a pre-defined footprint. tragic consequences. Earlier this year a cargo ship carrying automobiles from China to Mexico caught fire, sparked by what observers believe to be a malfunction within the vehicles’ electrical system, raising concerns around safety standards regarding EVs. The industry has relied on 12V power systems to supply power to their vehicles since the 1950s; however, as technology advances, so must the industry. With automakers requiring more power for EVs and PHEV models, the transition to 48V power systems and high-voltage batteries is inevitable. However, this move requires deep consideration concerning creepage and clearance safety requirements. In addition to upgrading the 48V bus, OEMs are moving to higher voltage batteries and further complicating creepage and clearance specifications. According to Market Report Analytics (MRA), the projected compound annual growth rate for 800V batteries will exceed 30% in the
https://www.vicorpower.com/ POWER MODULES 13 www.power-mag.com Issue 4 2025 Power Electronics Europe must be accounted for in automotive applications. The requirements prevent undesired consequences resulting from electric current jumping through air gaps, better known as electrical arcing. The effects of arcing can destroy components in the vehicle, causing loss of functionality within the vehicle if severe damage is done. In vehicles with legacy 12V power systems, arcing was accounted for through modest, but very measured component rubrics, but with EVs and PHEVs beginning the transition to 48V architecture, all forms of powertrains are facing this challenge. Design requirements must adjust to ensure safety, increasing the distance between conductors to reduce the risk of arcing. Why is a 48V architecture more risky for creepage and clearance design? 48V architecture introduces new challenges for the design engineer because of the increased voltage. Voltage increase creates higher potential for arcing. According to the IPC-2221 Standards, transitioning from a 12V architecture to one based on 48V can require upwards of a 60% increase in creepage and clearance distancing. Adhering to proper creepage and clearance standard ensures safety In 2024, The National Highway Traffic Safety Administration (NHTSA) reported 6.3 million vehicle recalls impacted by electrical systems, accounting for 33% of all recalls, highlighting the significance of component-related safety concerns. Many of these concerns can emanate from electric arcing, causing severe power system problems for OEMs. With the implementation of an 800V battery pack in a 48V architecture, the risk of arcing increases. Traditionally, when addressing this requirement within a design, engineers allowed for adequate spacing between conductors throughout the PCB. Voltage range, material properties and intended application dictate how the standards are established. Thorough calculations are required to properly space conductive parts to ensure compliance with these safety standards. Higher voltages require further distancing. While discrete component solutions can fulfill these requirements, their off-the-shelf components often consume a large footprint, as akin to a silver box power supply. These larger components demand up to a 60% size increase within the PDN framework, posing design challenge for OEMs to accommodate greater spacing needs within the same footprint. This is nearly impossible to achieve without design tradeoffs or innovating the approach. Overmolded packaging virtually eliminates the problem of arcing and improves thermals Solving the challenge of high-voltage arcing while taking into consideration the size and space constraints is not something many discrete components can do well. What can help is a traditional packaging process called potting. Potting encapsulates components to protect them from external vulnerabilities. However, potting restricts heat dissipation, causing elevated component temperatures that accelerate material degradation, further contributing to component failures and reduced lifespan. A more efficient approach to eliminate air gaps that enable arcing is through a proprietary overmolding process. With Vicor innovative packaging, the overmolding process neutralizes the risk of arcing while allowing for better heat dissipation. It also reduces size, enabling a high-density power source. The molding compound creates a solid insulation within the product, reducing creepage and clearance distances. The complete seal not only prevents pollutants from entering and causing an arc, but also reduces the size, further allowing for more space within the vehicle’s chassis to store components. Solving space constraints with highdensity power modules The matrix of transitioning from a 12V to 48V power system coupled with 400/800V batteries causes increased complications for the design engineer, demanding extra caution in PCB system design standards for EV and PHEV applications. This evolution of automotive architecture creates challenges to the OEM that needs to add more spacing between components within that same footprint. From larger battery packs to various powertrain components, OEMs must look for efficient solutions in accommodating space limitations inside the vehicle’s framework. With EVs and PHEVs rapidly adopting a 48V architecture where high-voltage batteries are used, OEMs must step down the voltage as efficiently and safely as possible. Bridging these gaps requires greater component distancing. This is where many discrete module suppliers Figure 3: The Vicor ChiPTM package uses a proprietary overmolding (middle layer in gray) which completely encapsulates components. These modules are therefore free from risk of arcing, while delivering high efficiency and advanced heat dissipation to cool components more effectively.
14 POWER MODULES https://www.vicorpower.com/ Issue 4 2025 Power Electronics Europe www.power-mag.com struggle. Discrete systems have trouble delivering high-power-density conversion that meets these safety requirements. For discrete solutions to adhere to proper spacing standards, they need to have a larger footprint. This increase of vehicle package space is what OEMs are keen to avoid. Vicor innovative high-density power modules are compact and lightweight, offering a lot more flexibility in solving the issue of space especially for 400/800V battery application. By reducing DC-DC converter weight by as much as 50% and package volume by 60%, Vicor power modules free up space, reduce system mass and improve design efficiency. With an 80% smaller packaging size than typical bus converters, the Vicor BCM6135 has many benefits for automotive applications. It offers leading power density of 20.8kW/L and design flexibility to meet challenging creepage and clearance standards. With a peak efficiency of 98%, input range varying from 800 to 48V, and an output range of 2.4 – 55V, the BCM6135 converts high voltage to SELV (48V) very effectively. Vicor high-performance BCM® bus converters, PRM™ regulators and DCM™ DC-DC converters help OEMs easily solve creepage and clearance challenges. These modules are capable of being used in parallel to scale power when needed. With high power density and compact size, these modules can be placed in tight areas. Conversely, discrete power components that are much bulkier and less efficient cannot provide the same versatility. Overmolded power modules enable safer, smaller designs in EVs The automotive industry is in a new era of innovation that requires a fresh approach for designing for higher voltage applications such as a 400 or 800V battery pack. If not addressed properly, arcing will hamper power designs and become a safety issue. The industry challenge is to do more (adding high voltages) but within the same space. Legacy discrete solutions are not able to achieve safe distancing for higher voltages and it’s important to innovate using Vicor’s patented overmolded power modules. With power modules, the challenges stemming from creepage and clearance are eliminated. From their proprietary overmolding processes to their miniaturized dimensions, Vicor high-density power modules are simplifying design challenges for creepage and clearance requirements. They are also able to deliver reliability and high efficiency while simultaneously downsizing designs and broadly eliminating arcing concerns for the OEM. Figure 4: The ability of Vicor’s solutions to efficiently address coverage and clearance requirements has important residual benefits. With Vicor products, the industry can transition from a hefty silver box, filled with hundreds of components, to a smaller, lighter more efficient enclosure. The smaller power modules enable the DC-DC converters, on board charger and inverter to be housed in a small box. Figure 5: BCM®, PRMTM and DCMTM power modules effectively address safety requirements while delivering high efficiency and minimising space consumption
RkJQdWJsaXNoZXIy MjQ0NzM=