20 INDUSTRIAL AND AUTOMOTIVE SYSTEMS https://www.ti.com/ Issue 3 2025 Power Electronics Europe www.power-mag.com support only 16 cells in series per device, managing larger stacks often involves using multiple monitors across different voltage domains. In these systems, the TXG8122 facilitates communication over the I2C interface between the MCU at 0V ground and the top battery monitor, which can sit at voltages at 25V or higher. When to Use Ground-Level Translators While galvanic isolators remain essential in high voltage and safety critical applications, understanding when to use a ground-level translator versus a digital isolator can help reduce system cost and size while improving performance. If safety is not a concern, transient voltages do not exceed 80V, and no isolation certifications are required, the family of ground-level translators is the best option. Following is a comparison between these two designs: Conclusion Ground mismatch is an increasingly common challenge in modern systems. Whether caused by DC shifts, AC ground noise, or intentional offsets, ground potential differences can introduce serious communication, reliability, and signal integrity issues. TI’s TXG family of groundlevel translators offers a compact, costeffective, and faster alternative to traditional methods, enabling seamless signal transmission across ground differences of up to ±80V. The portfolio offers scalability and design flexibility, empowering engineers to unlock new possibilities in a wide range of automotive and industrial applications. Trademarks All trademarks are the property of their respective owners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igure 7. Battery Stacking With TXG Figure 6. GaN Half-Bridge Power Stage With TXG To receive your own copy of Power Electronics Europe subscribe today at: www.power-mag.com
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