20 POWER-SUPPLY DESIGNS https://www.ti.com/ Issue 2 2025 Power Electronics Europe www.power-mag.com voltage to AC power. As clean energy requirements scale rapidly, it’s important to deliver high efficiency and high power with a small footprint using industry-standard devices. A TOLL GaN device can add value with an industry-standard footprint and integrated features. These devices can help you scale to different power levels and with different topologies using different drain-to-source on- resistances while not struggling with layout, since most sensing and optimization features are integrated in the power stage.TV power supplies There is sizeable growth potential in the large-screen (>40 inch) television market, as well as a trend toward lighter and thinner screens for aesthetic reasons. Because the power requirements increase with larger screens but the size is thinner, it’s important to make televisions more power efficient. AC/DC conversion can use the TOLL devices in the PFC and DC/DC stage. Integrated TOLL GaN devices enable you to keep the size of the passives the same and keep the external circuitry to a minimum with simple routing to deliver thinner printed circuit boards. The design will also be more efficient, while sticking to an industry-standard footprint. 2W, 3W and 4W onboard chargers Vehicle electrification is always in the news as the world strives toward reducing tailpipe emissions. Easy access to on-the-go charging necessitates electric vehicle onboard chargers (OBCs). Because its location in an electric vehicle is in the chassis, an OBC should be power dense and efficient in order to occupy minimal space and reduce losses, as there is no active cooling to dissipate losses. Figure 4 shows a typical OBC block diagram. An integrated TOLL GaN device can help both the PFC and DC/DC stage by optimizing design size through integration and a higher switching frequency, and reduce losses (gate drive and switching losses) for more effective heat dissipation. With TOLL GaN devices, at the device level all protections are enabled as well, which will help with the resiliency of the OBC design while keeping an industry-standard footprint. Conclusion One of the biggest design challenges that a power designer of the future will face is to deliver ever increasing power levels at the lowest possible losses with a highdensity design. An integrated TOLL GaN device helps here by combining integrated GaN with an industry standard footprint and eliminates the hassle of extra circuitry and complicated PCB layouts. This helps in making the design less cumbersome. Additionally, this will also enhance designs in other end equipment spaces such as motor drives, industrial power supplies and appliance power who also value simple, high density designs. With the GaN FET technology making leaps, we will keep investing and improving the figure of merit of the TOLL devices in the future, aiding the designers endeavor to deliver even higher power in the same space. Additional resources Check out the LMG3650R035 Evaluation Module EVM User’s Guide. Learn more about LMG3650EVM-113 evaluation module. Learn more about our GaN technology. Trademarks All trademarks are the property of their respective owners. Figure 4. Onboard chargers To receive your own copy of Power Electronics Europe subscribe today at: www.power-mag.com
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