4 INDUSTRY NEWS Issue 3 2024 Power Electronics Europe www.power-mag.com The electronics industry will soon be expected to play a big part in the European Union’s (EU) measures to create a more circular economy. The Ecodesign for Sustainable Products Regulation (ESPR) entered into force earlier this year to ensure the sustainability and traceability of electronics amongst other priority product groups. Currently, more than 50 million tonnes of e-waste are produced every year, contributing to it being the fastest-growing solid waste stream in the world. This is likely why the EU has named it as one of the priority product groups. The ESPR will apply to businesses placing electronics within the EU market even if those products weren’t produced in the EU. Businesses will be expected to implement Digital Product Passports (DPPs) to comply. In a nutshell, DPPs act as a digital record of a physical product, securely keeping track of information across a product’s lifecycle, including event or transactional data, or even data concerning its sustainability credentials. For example, the carbon footprint of its production. Through a data carrier like a QR code, a barcode, or an NFC tag attached to a physical product, information can be accessed by a device such as a smartphone. Through the implementation of DPPs and the digital record they provide on a product’s lifecycle and credentials, the EU hopes to encourage manufacturers and producers to adopt more sustainable practices and inspire circular thinking past the point of manufacture. Crucially for the electronics industry, it will provide insight into the effective disposal of end-of-life (EOL) electronics, which is expected to encourage recycling and circularity. The delegated acts - specific compliance requirements for each product group impacted - are expected to be announced next year. These will include specific timing requirements for compliance for the priority groups. DPP solution provider Protokol is currently working with businesses that are getting ahead of the delegated acts to ensure they are in the best shape to meet compliance standards for what will require a more streamlined approach to collecting and sharing product data. The advised first steps are to create a team that will track regulatory updates, begin taking stock of data points that may be required and engage with stakeholders to understand their current planning for compliance. For more information, visit: https://www.protokol.com/services/digitalproduct-passport-consulting/ The EU’s Ecodesign for Sustainable Products Regulation enters into force Infineon launches ultra-high current density power modules to enable high-performance AI computing Data centres are currently responsible for more than 2% of global energy consumption. Fuelled by AI, this number is expected to grow to up to around 7% in 2030, matching the current energy consumption of India. Enabling efficient power conversion from grid-to-core is vital to enable superior power densities and thereby advance compute performance while reducing total cost of ownership (TCO). Infineon Technologies has announced it has therefore launched the TDM2354xD and TDM2354xT dual-phase power modules with best-inclass power density for high-performance AI data centres. The company says these modules enable true vertical power delivery (VPD) and offer industry’s best current density of 1.6 A/mm 2. They follow the TDM2254xD dual-phase power modules introduced by Infineon earlier this year. “We are proud to enable high-performance AI data centres with our TDM2354xT and TDM2354xD VPD modules. These devices will maximise system performance with Infineon’s trademark quality and robustness, thereby enabling best TCO for data centres,” said Rakesh Renganathan, Vice President Power ICs at Infineon Technologies. “Our industry-leading power devices and packaging technologies, combined with our extensive systems expertise, will further advance high-performance and green computing as part of our mission to drive digitalisation and decarbonisation.” Infineon says the TDM2354xD and TDM2354xT modules combine its robust OptiMOS 6 trench technology, a chip-embedded package that enables superior power density through enhanced electrical and thermal efficiencies, and a new inductor technology to enable lower profile and therefore, true vertical power delivery. As a result, the modules set new standards in power density and quality to maximise the compute performance and efficiency of AI data centres. The TDM2354xT modules support up to 160 A and are said to be the industry’s first Trans-Inductor Voltage Regulator (TLVR) modules in a small 8 x 8 mm? form factor. Combined with Infineon’s XDP controllers, they offer extremely fast transient response and minimise on-board output capacitance by up to 50%, further increasing system power density. The new modules will be showcased at Infineon’s global technology forum OktoberTech 2024 in Silicon Valley on 17 October and at electronica 2024 in Munich from November 12 to 14 (hall C3, booth 502).
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