28 PRODUCT UPDATE Issue 3 2024 Power Electronics Europe www.power-mag.com Microchip’s RTG4 FPGAs with lead-free flip-chip bumps achieve highest space qualification EIRE300 Open Frame AC-DC Power Series Vox Power has announced the EIRE300 series, an advanced range of AC/DC power supplies that combines compact design with exceptional reliability and efficiency, designed for medical and ITE applications, the EIRE300 delivers 300 Watts with a peak output of 375 Watts within a compact 4” x 2” footprint and a slim 1” profile. The company says the EIRE300 series stands out with its best-in-class power density exceeding 37.5W/in? and efficiency reaching up to 95%, significantly minimising power losses and enabling it to outperform all other products available on the market. It offers versatility with unrivalled convection-cooled ratings of 200 Watts (115VAC), making it suitable for a wide range of applications. Engineered for seamless integration into medical and industrial applications, the EIRE300 features 2 x MOPP isolation, low leakage currents, standard mounting holes and a dedicated auxiliary fan supply. Additional standard features include internal dual line fusing, remote sensing, and an AC_OK signal. The EIRE300’s low standby power consumption of typically 0.25W makes it optimal for energy-critical applications. The series is not only certified to the latest international Medical and ITE Safety Standards but also offers a “BF” rating, making it suitable for equipment that requires direct contact with patients. This rating is crucial for applications like surgical instruments and critical care medical devices, ensuring that they can be safely used close to the patient without risk of electrical hazards. The EIRE300 series offers a range of output voltages from 12V to 60V, including standard options of 12V, 15V, 18V, 24V, 28V, 36V, 48V, and 54V. Each output has a wide adjustment range, ensuring compatibility with most non-standard voltage requirements within this range. Comprehensive protection features such as overvoltage, over-current, and over-temperature safeguards are standard. Designed for both Class I and Class II equipment, the EIRE300 meets EMC Class B standards for conducted and radiated emissions. It is capable of operating at altitudes up to 5000 meters and is approved to 60601-1 and 62368-1 for medical and ITE applications, as well as compliant with 60601-1-2 (EMC), 60335-1 (Household appliances), 61010-1 (Measurement, Control & Laboratory Equipment) and 61558-1 (Safety of Power Transformers) standards. To maximise reliability and performance, the product design utilises ultra long-life electrolytic capacitors and comes conformal coated as standard to protect against environmental contaminants. Its highefficiency design reduces heat output, supporting a wide operating temperature range of -40°C to 70°C, with a calculated MTBF exceeding 500k hours. Satisfying mission assurance requirements for the most critical space programs, Microchip Technology says its Radiation-Tolerant (RT) RTG4 Field- Programmable Gate Arrays (FPGAs) with lead-free flip-chip bumps have earned the Qualified Manufacturers List (QML) Class V status. The company says as designated by the Defense Logistics Agency (DLA), QML Class V is the highest level of qualification for space components and a necessary step to satisfy mission assurance requirements on the most critical space missions such as human-rated, deep space and national security programs. Because QML qualifications are standardised based on specific performance and quality requirements governed by the DLA, customers can streamline their design and certification processes by using QML-qualified products. In 2018, RTG4 FPGAs became the first RT FPGAs offering more than 150,000 logic elements to achieve a QML Class V qualification, and this nextgeneration solution with lead-free flip-chip bumps is the first of its kind to achieve QML Class V status. In advanced flip-chip package construction, such as that used in the RTG4 FPGA, flip-chip bumps are utilized to connect the silicon die and the package substrate. Lead-free bump material will help extend the longevity of the product, which is critical to space missions. “This is another milestone for our RTG4 FPGAs that will provide customers with added confidence in designing these devices in space flight systems, while allowing them to take advantage of our high-reliability, zeroconfiguration-upset and low-power consumption FPGAs,” said Bruce Weyer, Corporate Vice President for Microchip’s FPGA Business Unit. “For more than 60 years, Microchip solutions have powered space flight missions, and we are dedicated to product longevity and providing the highest quality solutions.” RTG4 FPGAs are designed to bring high levels of density and performance to space applications, saving cost and engineering efforts through low power consumption and immunity to configuration upsets. Unlike SRAM-based FPGA alternatives, the programming technology used in RTG4 FPGAs provides low static power, which assists in managing thermal issues common in spacecraft. RTG4 FPGAs consume only a fraction of the total power compared to equivalent SRAM FPGAs, while exhibiting zero configuration upsets in radiation and thus requiring no mitigation, reducing engineering expenses and total system costs.
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