Power Electronics Europe February/March 2022

www.apec-conf.org/ APEC 2022 17 www.power-mag.com Issue 1 2022 Power Electronics Europe conduction loss and to increase breaking capability. Parallel connection of power semiconductor devices is the most suitable solution to those issues. The proposed solid-state DC circuit breaker can be clamped to SiC MPS diode with high avalanche tolerance and robust characteristics under repetitive avalanche events. Experimental results show that the proposed solid-state DC circuit breaker can interrupt the 50-A current under UIS tests circuit with a 400-V DC distribution system. RAP sessions On the Tuesday, March 22, the so-called interactive RAP-sessions will take place in the afternoon from 5:00 - 6:30 pm. Session 1 “Switch Capacitor vs. Inductor Based Topologies” feature the panelists Robert Pillawa – University of California Berkley , Loai Salem – University of California Santa Barbara , Jose Cobos – Universidad Politécnica de Madrid , Roger Chen – Texas Instruments , Nicola Femia – University of Cassino, and FC Lee – Virginia Tech . In the search for higher power density, higher efficiency, and lower cost, power supply designers have pursued a wide range of alternative topologies. The panelists for this session have explored different topologies that are centered on either switched capacitor structures or inductors. Come explore the benefits of each approach and the applications where they can provide distinct benefits, and learn from experts about their vision for the future of high-density power conversion. Session 2 “Challenges and potential of AI based design vs. conventional design” feature Alfonso Martínez – Frenetic , Minjie Chen – Princeton University , Joao Pinto – Oakridge National Labs, Alex Huang – University of Texas at Austin , Dushan Broyevich – Virginia Tech , and Dragan Maksimovic – University of Colorado Boulder . The past few years have seen a remarkable growth in artificial intelligence in many applications. Power electronics is no exception in that researchers are investigating new ways to model and design power electronics using some form of artificial intelligence. This panel is comprised of several thought leaders in the area of power electronics design – both utilizing AI techniques and without. They will discuss aspects of power electronics design that AI can improve or at least provide keener insight, and where traditional design methods remain superior or necessary. Session 3 “Magnetics in IC vs. Magnetics in PCB” feature Matt Wilkowski – Enachip , Francesco Carobolante – IoTissimo , Alex Hanson – University of Texas at Austin , P. Markondeya Raj - Florida International University , Doug Hopkins – North Carolina State University, and Khurram Afridi – Cornell University. As the journey to miniaturize the power supply and quest for higher efficiency continues, integration of magnetics creates new challenges and opportunities. To this effect a considerable amount of innovation has been done to integrate magnetics in ICs and PCBs. This includes Magnetics implemented on chip, in package, embedded in PCB, on PCB and new magnetics technologies. Each approach has its own tradeoffs in terms of efficiency, size, power delivery, reliability, cost and EMI. What would be the right approach for your application? Thus APEC will provide an overview on current and future trends in power electronics. Hopefully this event can be held as intended. AS All major names of the power electronics industry will attend APEC 2022 as with the 2019 event Photo: AS www.power-mag.com