April/May 2021

PCIM 2021 21 The global automotive market is since years in a crisis and the Corona pandemic is increasing the situation. Till 2017 the number of manufactured cars increased up to 96 million followed 2018 with a stable number and in 2019 the numbers declined by 4,5% and in 2020 the number of produced cars could drop to 75 million. The general trend that parts of the automotive market is moving to China becomes visible on the latest numbers. In front of the second wave of the pandemic in Europe, China is reporting an increase of their sales numbers over the last 3 month of 8,5%. China has become the rescuer for the German automotive industry. In 2018 the biggest player VW, Daimler and BMW sold 35,6% of their worldwide turnover in China. The EU defines a reduction of the CO2 emission down to 95 g CO2/km on average for the fleet until 2021. At the moment a further reduction to about 60 g CO2/km until 2030 is planned. China - the leading region bringing electro mobility on the street - for example targets to reduce the average fuel consumption down to 5 l/100 km until end 2020. All these goals are only reachable with high-voltage electrification, based on HV power semiconductors and power packaging with high efficiency. The European automotive market has reacted on these challenges by developing technologies to follow these targets and try to keep the business in Europe. To improve the efficiency in modern cars on the way to electro mobility the power density has to increase without limitations on performance and reliability. To realize these requirements many ingredients are necessary taken into account. New module concepts with wide gap semiconductors are the best candidates to face these challenges. Priority is on thermal management and handling of high current. The implementation of power semiconductors directly into the printed circuit board (PCB) is a very promising approach to fulfill these requirements. AT&S successfully used the expertise with its ECP (Embedded Components Packaging) technology for the implementation of efficient power packages and modules. This made it possible to reduce the space required for power packages by up to 50% with correspondingly higher power density. In addition, it showed that very good results are achievable in terms of switching behavior, heat removal and power cycling robustness. The third keynote on the Thursday (May 6, 11:50 am) by Seddik Bacha, Program Scientific Director, SuperGrid Institute, France highlights “HVDC Grid Challenges Locks and Opportunities“. Beyond the HVDC drivers, the problem of hosting and routing the huge quantities of renewable energies can be seen as the timely major challenge for the Transmission System. It imposes new physical architectures and new operation schemes. To address these issues, specialists are admitting a paradigm: actual HV AC grid enhancing or building new HVDC grid beside the older one? The first solution is based on new lines commissioning associated with FACTS devices. The second possibility consists on the planning of a complete HVDC structure which will collaborate with the existing HV AC grid. The realistic solution consists on a compromise between the two possibilities. In the both cases, Power Electronics plays a key role on the actual operation and on the future grid development via HVDC applications. It offers the possibility to control the energy flows through optimal pathways, to interconnect no synchronized areas, to transfer the energy through long distances and make feasible large subsea interconnections. However new issues arise from the HVDC systems and their associated Power Electronics Devices. Some of them are affecting the grid stability itself and other the protection plan; for instance, the grid inertia and the Short Circuit Ratio decrease. As the Aesop tong, the Power Electronics is affecting and will affect the grid operation but in the same, it offers the solutions for these issues and new possibilities for enhancing the actual grid performances. The conference will introduce the drivers for HVDC developments, will present the inherent locks and will propose some opportunities and solutions to discuss. An overview on the full program is available under https://pcim.mesago.com/nuernberg/en/conference/program- speakers/program.html Name: Company Name: Address: Post Code: Tel: Total Number of Copies @ £ p+p Total £ Drives S & S Hyd H/B Pne H/B Ind Mot Comp H/B H/B Air DFA MEDIA LTD, QUANTITY QUANTITY Hydraulics & Pneumatics There are now 6 of these handy reference books from the publishers of the Drives & Controls and Hydraulics & Pneumatics magazines. Published in an easily readable style and designed to help answer basic questions and everyday problems without the need to refer to weighty textbooks. We believe you’ll find them invaluable items to have within arms reach. From the publishers of QUANTITY QUANTITY QUANTITY If you would like to obtain additional copies of the handbooks, please complete the form below and either fax it on 01732 360034 or post your order to: Cheques should be made payable to DFA MEDIA LTD and crossed A/C Payee. Copies of the handbooks are available at £4.99 per copy. Discounts are available for multiple copies. 2-5 copies £4.30, 6-20 copies £4.10, 20+ copies £3.75. QUANTITY PRACTICAL ENGINEER’S HANDBOOKS HYDRAULICS INDUSTRIAL MOTORS SERVOS AND STEPPERS PNEUMATICS COMPRESSED AIR INDUSTRIAL ELECTRIC DRIVES PLEASE ALLOW UPTO 28 DAYS FOR DELIVERY 192 The High Street, Tonbridge, Kent TN9 1BE Engineers Handbook, DFA MEDIA LTD, 192 The High Street, Tonbridge, Kent TN9 1BE Postage and Packaging: 1-3 copies: £2.99 4-6 copies: £4.99 7 or more copies: £6.99